Aug 6, 2014 -- STATS ChipPAC Ltd. has announced the recipients of its seventh annual Supplier Awards, honouring the excellent performance and outstanding contributions of the Company’s top suppliers in 2013.
STATS ChipPAC’s top honour, “Best Supplier Award”, was given to four suppliers for overall best-in-class performance in cost, quality, delivery, technology, service and support. Six suppliers were recognised with an “Outstanding Award in Service and Support” for excellence in service, support and responsiveness. For their outstanding service and support for a particular STATS ChipPAC manufacturing site, four companies received “Outstanding Site Award in Service and Support”.
The winners by category are:
Best Supplier Award
- Daewon SPIC/Peak International
- DISCO Corporation
- Kinsus Interconnect Technology Corporation
- NAMICS Corporation
Outstanding Award in Service and Support
- Advantest Corporation
- Duksan Hi-Metal Co., Ltd.
- Kulicke & Soffa Industries, Inc.
- Lam Research Corporation
- Mitsui High-tec, Inc.
- Teradyne, Inc.
Outstanding Site Award in Service and Support
- Hon. Technologies, Inc. (for STATS ChipPAC Shanghai)
- Oriental Mercury International Cargo Transportation Co., Ltd. (for STATS ChipPAC Shanghai)
- SUSS MicroTec AG (for STATS ChipPAC Singapore)
- UBoT Incorporated Limited (for STATS ChipPAC Shanghai)
“The strong relationships we have with our suppliers are vital to our business and enable us to deliver compelling advantages to our customers in cost effective, high quality packaging and test solutions. With our strategic focus on advanced flip chip and wafer level packaging turnkey solutions, it is critical that our suppliers are well-aligned with our technology roadmap and are able to respond quickly to our customers’ time-to-market requirements,” said Cindy Palar, Senior Vice President of Strategic Operations, STATS ChipPAC. “We are pleased to recognise our top suppliers’ outstanding achievements and congratulate each of them for a job well done.”
