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Molex Spotlights High-Speed Data Connectivity and Expertise at DesignCon 2018

LISLE, Ill. — (BUSINESS WIRE) — January 24, 2018Molex, a global provider of integrated electronic products, will showcase high-speed data connectivity solutions at DesignCon 2018 in Santa Clara, CA, January 31-February 1, 2018. Molex, booth 633, will feature next-generation technologies designed to meet rising data speeds and bandwidth in demanding networking and high-performance computing applications.

“As more data is generated and infrastructure moves to the cloud, next-generation I/O and cabling solutions support faster processing, more bandwidth, increased density and thermal management—while maximizing data flow efficiency and reliability in today’s data centers,” said Jairo Guerrero, general manager of enterprise solutions, Molex.

At DesignCon 2018, Molex will display the following demos:

Additionally, Molex will join other industry experts in two technical sessions at DesignCon 2018:

For more information about next-generation high-speed connectivity, please visit the Molex booth at DesignCon 2018 or www.connector.com/solutions/designcon.

About Molex:

Molex brings together innovation and technology to deliver electronic solutions to customers worldwide. With a presence in more than 40 countries, Molex offers a full suite of solutions and services for many markets, including data communications, consumer electronics, medical, industrial, automotive, and commercial vehicle. For more information, please visit  www.molex.com.

Molex Resources:

Molex is a registered trademark of Molex, LLC in the United States of America and may be registered in other countries; all other trademarks listed herein belong to their respective owners.



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