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Siemens extends support of multiple IC design solutions for Samsung Foundry’s latest process technologies

ESD rule deck qualifications
Verification for design compliance with foundry electrostatic discharge (ESD) rules is a critical step in the design tape out process. The number of checks required, combined with the sheer volume of design data for full chip simulation at advanced technology nodes, demands an extremely robust physical reliability platform.

Siemens’ Calibre PERC software’s advanced algorithm development functionality, parallel compute capabilities, and automated context-aware architecture have created a paradigm shift in analysis methodology. These developments have slashed the runtime of full chip ESD verification by half while maintaining accuracy, improving verification quality, increasing checking coverage, and allowing for world-class speed in new kit development. Working closely with Samsung, Siemens developed a flow capable of being automated from a single configuration file. This flow can rapidly generate verification kits for different technologies and with minimal development effort. Samsung Foundry is the first foundry globally to leverage the parallel compute capabilities of Calibre PERC in their ESD checking solution. All of these have resulted in dramatically improved runtimes, reliability, and maintainability for Samsung’s advanced full chip PERC analysis kits.

Samsung and Calibre in the cloud
Siemens and Samsung have also developed best practices for design teams looking to leverage cloud scaling for even faster physical verification run times. These best practices include setting up batch Calibre nmDRC runtimes, in addition to other Calibre products that design teams might choose to run, such as Calibre SmartFill software, once they have placed their design on the cloud. Samsung and Siemens will present the results of this joint project, which leveraged the Calibre tool’s latest engine technologies and Calibre design kits tuned for cloud environments, at the upcoming Samsung SAFE Conference on November 17, 2021.

"Samsung Foundry’s long-term partnership with Siemens continues to help our shared customers deliver highly innovative and differentiated ICs,” said Joe Sawicki, executive vice president for Siemens’ IC EDA segment. “With these optimized Siemens solutions in advanced packaging and cloud computing, our mutual customers have more options in getting their products created.”

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