[ Back ]   [ More News ]   [ Home ]
Siemens collaborates with Samsung Foundry to expand 3D-IC enablement tools, optimize other EDA solutions for foundry’s newest processes

Siemens Digital Industries Software today announced that, in collaboration with Samsung Foundry, they have developed compelling new capabilities for the manufacture of multi-die packaged designs at advanced nodes and achieved a host of new product certifications for many of Siemens’ industry-leading IC design and verification technologies.
 
"Our expanded collaboration with Siemens EDA will help us deliver advanced design enablement solutions that address the evolving needs of our customers," said Sungjae Lee, Vice President and head of Foundry PDK Development Team at Samsung Electronics. "By aligning our roadmaps and optimizing the entire design flow, we can drive advanced packaging innovation across key markets like 5G, automotive, and AI."
 
Siemens and Samsung: boosting 3D-IC manufacturability
Siemens and Samsung Foundry recently collaborated to update process design kits (PDKs) that seamlessly integrate into Siemens’ Xpedition™ Substrate Integrator (XSI) software and Xpedition™ Package Designer (XPD) software – an achievement that allows Samsung to deliver robust PDK updates to mutual customers with minimal disruption to design processes. Siemens’ XSI software empowers engineers to construct a comprehensive digital twin model of an entire multi-die device, enabling seamless design integrations capable of driving all downstream design, analysis, verification, and signoff activities.
 
Samsung also successfully evaluated Siemens’ digitally integrated High Density Advanced Packaging (HDAP) flow for the foundry’s MDI (multi-die-integration) packaging process. Siemens’ Calibre® xACT™ 3D software and Calibre xL parasitic extraction tools, which quickly and accurately extract register clock parasitics in complex 2.5D and 3D packaging configurations, are now certified for Samsung’s most advanced process nodes, as part of Siemens’ larger Calibre® nmPlatform tool. The parasitic extraction tools within Calibre support signal integrity-aware analysis of entire high bandwidth memory (HBM) channels implemented on 3.5D silicon interposers. Samsung has also qualified decks (4nm technology) for the dies with through silicon vias (TSV) and validated the capability and accuracy of the Calibre parasitic extraction tools for TSV extraction and TSV coupling extraction tasks.
 
Samsung certifies multiple Siemens EDA product lines and reference flows
Among the many additional recent achievements of the Siemens EDA/Samsung partnership are:

"In today's fast-paced IC design and fabrication landscape, synergy between partners is essential to meeting the increasingly challenging and complex requirements of our mutual customers," said Mike Ellow, CEO of Silicon Systems for Siemens Digital Industries Software. "Our collaboration with Samsung Foundry epitomizes this synergy. Together, we're working to deliver the power, performance and area advantages of 3D-IC architectures for our mutual customers. These advances, together with a raft of new Siemens EDA product certifications and novel design innovations, are now available to help our mutual customers differentiate and win in exceedingly competitive global markets.”

Siemens Digital Industries Software helps organizations of all sizes digitally transform using software, hardware and services from the Siemens Xcelerator business platform. Siemens' software and the comprehensive digital twin enable companies to optimize their design, engineering and manufacturing processes to turn today's ideas into the sustainable products of the future. From chips to entire systems, from product to process, across all industries,  Siemens Digital Industries Software – Accelerating transformation.

Contact

Siemens Digital Industries Software PR Team
E-mail: Email Contact