Milford, OH, March 28, 2013 – International TechneGroup, Incorporated (ITI) announced today their continued sponsorship of the Collaboration and Interoperability Congress 2013 event in Colorado Spring, CO, May 21 - 23. ITI has sponsored the CIC event for the past ten years, finding it an ideal forum for vendors, standards organizations and users to exchange ideas on important collaboration and interoperability issues facing industries today.
“The CIC event assists ITI in maintaining a strong alignment between our interoperability solutions and the needs of our clients” says Don Hemmelgarn, President of ITI’s TranscenData product data interoperability business. “We see CIC as an excellent opportunity to meet end users and discuss their interoperability requirements and experiences.”
ITI is pleased that two of their board members have been selected as featured speakers for this year’s CIC. Tom Kurfess, ITI Board Member and former Assistant Director for Advanced Manufacturing at the Office of Science and Technology Policy in the Executive Office of the President of the United States will deliver the Keynote Address: A Roadmap for Impact: Driving Innovation in the New Age of Manufacturing. Dr. Kurfess indicated that manufacturing is thriving in the United States, and with the proper focus, we can ensure our Nation’s leadership in manufacturing for generations to come, providing the United States with economic prosperity and national security.
Bob Kiggans, Vice Chairman of ITI’s Board of Directors, Vice Chairman at SCRA Applied R&D and Chairman at Intelligent Manufacturing Systems will present: The Way Forward for Advanced Manufacturing and Innovation. “CIC is a great conference” stated Kiggans, “I always come away with new, creative ideas, as well as valuable industry contacts.”
ITI’s Director of CAD/CAM Integration Services, John Gray, has also been selected to present on ITI’s DoD Award Winning Program: Customer Supplier Interoperability (CSI). Gray’s presentation: CSI - More Effective Collaboration for the Model Based Environment will inform attendees how major DoD projects such as the F-35 can discover significant ROI from more effective methods of interoperability and collaboration.
Experienced ITI consultants will be on site at CIC, where customers can meet and learn more about their interoperability solutions like CSI as well as CADfix, CADIQ, DEXcenter and Proficiency. For more information on CIC or to register to attend, visit: http://www.3dcic.com
About ITI and ITI TranscenData
International TechneGroup Incorporated (ITI) was founded in 1983 and is headquartered in Milford, OH. ITI TranscenData is the product data interoperability business within ITI. CAD/CAM/CAE/PLM vendors and end users alike utilize ITI TranscenData's products and services for seamless data exchange between dissimilar systems. Customers include ABB, Airbus, BAE Systems, Boeing, Dassault, EADS, Ford, Honeywell, Lego, Lockheed Martin, NASA, MAHLE Powertrain, Pratt & Whitney, Raytheon, Renault, Rockwell Collins, Samsung Electronics, Siemens, Snecma, Spirit AeroSystems, Thales, ThyssenKrupp, US Air Force, US Army, Xerox and others.
For more information about ITI TranscenData’s products and services, visit
www.transcendata.com
email:
Email Contact, or call 1-888-783-9199 x3858
