DATE 2014 receives 1090 paper submissions; an all-time high for DATE and an 8% increase over DATE 2013
28 November 2013 -- DATE is truly an international conference. Besides the large share (46%) of submissions coming from Europe, 23% of submissions are from North- America, 27% from Asia, and 4% from the rest of the world. This clearly demonstrates DATE’s global reach and impact.
The most successful topics were: “Architectural and Micro architectural Design” in the Design Methods and Tools Track, “Secure Systems” in the Application Design Track, “On-Line Test, Fault Tolerance and Reliable System Design” in the Test and Reliability Track and “Real-time, Networked, and Dependable Systems” in the Embedded Systems Software Track.
For the 17th successive year DATE has prepared an exciting technical program. With the help of 339 members of the Technical Program Committee who carried out 3620 reviews (more than four per submission), finally 206 (=23.1%) papers were selected for regular presentation and 107 (= 12.0%) for interactive presentation.
In addition, the DATE conference programme includes several hot-topic sessions and embedded tutorials, highlighting special-interest topics in the areas of Automotive, Security, Reliability, Mixed-Signal and Emerging Transistor Technologies, as well as several panels covering EDA challenges in emerging technologies and debating future directions. Twelve half-day tutorials will be given on Monday, with topics ranging from Energy-Efficient System Design to Post-Silicon Validation and Debug. On Friday several full-day workshops cover a large number of hot topics like dependable GPU computing, simulation for cyber-physical systems, multicore architectures at nanoscale or 3D Integration.
The conference online registration and the complete advance programme will be available on the DATE web site starting from mid-December 2013.
Special Day on System Level Design
“The exploitation of recent technology achievements such as more and more processor cores and other IP modules available on a chip today is currently of big interest to many developers in application areas of embedded systems such as automotive, industrial automation and avionics. But there are also very challenging expectations on the achievable improvements and on the available support by tool vendors and system houses to aid handling this increasing system complexity”, says Jürgen Teich, co-chair of the DATE 2014 Special Day on System Level Design.
This special day will therefore reflect current industrial practices as well as present recent advances in the System Level Design research area. A particular emphasis will be on ultra-low power design and modeling at multiple abstraction levels, virtual platforms for software development and architecture design of MPSoCs. A panel on “HW/SW Co-Development – The Industrial Workflow” will take place in the afternoon to discuss opportunities and challenges of joint hardware and software development. Moreover, two hot-topic sessions in the morning on “The fight against Dark Silicon” and “Predictable Multi-Core Computing”, and a special session on “System Simulation and Virtual Prototyping” in the afternoon will comprise this special day’s schedule.
A particular highlight of the day is the special day´s keynote speech by Dr. Michael Bolle (Executive Vice President Engineering, Bosch), talking about the “Auto cockpit of the future”.
Special Day on Advancing Electronics Beyond CMOS
As the issues associated with CMOS scaling become harder and more costly to solve, this special day will cover the latest trends towards alternative devices and paradigms for computing and data acquisition, storage and transport. In particular, this special day begins with two hot-topic sessions on “CMOS scaling: evolutionary to revolutionary” and “Memories today and tomorrow”. An embedded tutorial on “Alternatives to CMOS” takes place after lunch, followed by a last hot-topic session on “The future of interfacing to the natural world”.
The special day’s keynote speaker, Prof. Karl Leo (Director, Fraunhofer Institute COMEDD), will talk about “Organic Electronics –From Lab to Markets”.
Contact:
Gerhard Fettweis,
General Chair
Technical University Dresden, DE
Email Contact
Luca Fanucci,
Programme Chair
University of Pisa, IT
Email Contact
