New Chips Utilize Cutting-Edge 15nm Process
IRVINE, Calif., Oct. 1, 2014 — (PRNewswire) — Toshiba America Electronic Components, Inc., (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced the launch of a class of e-MMCTM [1] embedded NAND flash memory products that are among the world's smallest[2].The new products integrate NAND chips fabricated with Toshiba's cutting-edge 15nm process technology and a controller to manage basic control functions for NAND applications into a single package.Fully compliant with the latest JEDEC e-MMC standard, the new chips are designed for application in a wide range of digital consumer products, including smartphones, tablet PCs and wearable devices. Sample shipment of the 16 gigabyte[3] (GB) products begins today, with 8GB, 32GB, 64GB, and 128GB products to follow.
By utilizing the 15nm process technology, the new product's package size is approximately 26 percent smaller[4] than comparable Toshiba products[5] and offers faster read/write performance due to improvements in basic chip performance and controller optimization. The read speed is approximately eight percent faster (max.), while the write speed is approximately 20 percent faster (max.).
"With the introduction of 15nm-based e-MMC, Toshiba continues to demonstrate its leadership in NAND Flash and embedded memory solutions targeting mobile and wearable devices," noted Scott Beekman, director of managed NAND memory products for TAEC. "The small 11mm x 10mm package, supporting a wide range of densities, is well-suited for increasingly space limited applications."
Demand continues to grow for large density NAND flash memory chips that support high resolution video and deliver enhanced storage. This is particularly true in the area of embedded memories with a controller function, which minimize development requirements and ease integration into system designs. Toshiba is meeting this demand by reinforcing its line-up of high performance and high density memory products.
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New Product Line-up | ||||
|
Product Name |
Capacity |
Category |
Package |
Mass Production |
|
THGBMFG6C1LBAIL |
8GB |
Supreme |
11.5x13x0.8mm |
2Q, 2015 (Apr.-Jun.) |
|
THGBMFG6C1LBAIT |
8GB |
Supreme |
11x10x0.8mm |
2Q, 2015 (Apr.-Jun.) |
|
THGBMFG7C2LBAIL |
16GB |
Supreme |
11.5x13x0.8mm |
1Q, 2015 (Jan.-Mar.) |
|
THGBMFG7C2LBAIW |
16GB |
Supreme |
11x10x1.0mm |
1Q, 2015 (Jan.-Mar.) |
|
THGBMFG7C1LBAIL |
16GB |
Premium |
11.5x13x0.8mm |
1Q, 2015 (Jan.-Mar.) |
|
THGBMFG8C4LBAIR |
32GB |
Supreme |
11.5x13x1.0mm |
1Q, 2015 (Jan.-Mar.) |
|
THGBMFG8C4LBAIW |
32GB |
Supreme |
11x10x1.0mm |
1Q, 2015 (Jan.-Mar.) |
|
THGBMFG8C2LBAIL |
32GB |
Premium |
11.5x13x0.8mm |
1Q, 2015 (Jan.-Mar.) |
|
THGBMFG9C8LBAIG |
64GB |
Supreme |
11.5x13x1.2mm |
1Q, 2015 (Jan.-Mar.) |
|
THGBMFG9C8LBAIX |
64GB |
Supreme |
11x10x1.2mm |
1Q, 2015 (Jan.-Mar.) |
|
THGBMFG9C4LBAIR |
64GB |
Premium |
11.5x13x1.0mm |
1Q, 2015 (Jan.-Mar.) |
|
THGBMFT0CBLBAIS |
128GB |
Supreme |
11.5x13x1.4mm |
2Q, 2015 (Apr.-Jun.) |
*In Toshiba e-MMC categories, "Supreme" represents products suited to high-end class applications and "Premium" represents products for middle- and low-end class applications.
Key Features
- The JEDECe-MMC compliant interface handles essential functions, including writing block management, error correction and driver software. It simplifies system development, allowing manufacturers to minimize development costs and speed up time to market for new and upgraded products. Additionally, new features <1 | 2 Next Page »
