UMC Broadens its 55nm eFlash Platform with Faraday's Silicon-proven IP

Faraday's IPs with HVT Core Devices Reduce Power by Up to 65% to Target Power-sensitive Market Applications

HSINCHU, Taiwan, March 12, 2015 — (PRNewswire) — Faraday Technology Corporation (TAIEX: 3035), a leading fabless ASIC/SoC and IP provider, and United Microelectronics Corporation (UMC) (NYSE: UMC, TWSE: 2303), a leading global semiconductor foundry, today announced the availability of a complete set of low power consumption fundamental IPs developed for UMC's 55nm Low Power (LP) embedded Flash process. These IPs are designed to simultaneously meet both low-power and high-density requirements to satisfy the demands of a broad range of applications including IoT (Internet of Things) and wearable products.

Low-power is prioritized for always-on devices in order to extend battery life. To fulfill the requirement, Faraday's memory compilers greatly reduce power consumption in the standby mode by up to 70% through optimization of the low leakage memory periphery. The robust I/O cells are available for both digital and analog interfaces, with a high voltage I/O cell option available that is especially compatible with a 5.0V interface. These IO cells are designed by using HVT core device to reduce leakage power. Furthermore, the IP suite also includes a new low-power USB 2.0 OTG PHY with HVT core device, which significantly reduces power consumption in the idle mode by up to 65% over traditional USB 2.0 OTG PHY.

"Faraday has been cooperating closely with UMC to build robust platform solutions for power-sensitive applications spanning from 0.18um to 0.11um, and now on 55nm eFlash," said Jensen Yen, associate vice president of marketing and spokesperson at Faraday Technology. "Our IP expertise and high familiarity with UMC processes led to these newly-launched IPs with UMC's HVT core devices that significantly reduce power consumption, greatly catering to the growing IoT market. With this important milestone and our continuous collaboration with UMC, we are confident that our mutual customers will soon be able to seize new business opportunities in the IoT market."

"UMC continues to broaden our strong IP portfolio to bring more low-power benefits to IoT chip designers," said Shih Chin Lin, senior director of IP Development & Design Support Division. "Our 55nmLP SST embedded flash technology is a widely adopted, mass production process that is supported by strong IP and design resources. We are happy to add Faraday's IP as part of our 55nm platform resources to help customers broaden their opportunities in power-sensitive applications. We look forward to working with them to deliver future IP solutions in the future."

Faraday's complete IP set on 55nmLP SST embedded Flash process includes the standard cell libraries, memory compilers, diffusion programmable ROM, Via ROM, I/O cells, and low power USB 2.0 OTG PHY. The 3-series cell libraries, 7-track miniLibâ„¢, 8-track generic libraries, and 12-track UHS-Libâ„¢ are all equipped with the low-power management of PSK cells and multi-Vt options.

About UMC

UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced technology and manufacturing for applications spanning every major sector of the IC industry. UMC's robust foundry solutions allow chip designers to leverage the company's leading-edge processes, which include 28nm poly-SiON and gate-last High-K/Metal Gate technology, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i. Fab 12A consists of Phases 1-4 which are in production for customer products down to 28nm. Construction has been completed for Phases 5&6, with future plans for Phases 7&8. The company employs over 15,000 people worldwide and has offices in Taiwan, mainland China, Europe, Japan, Korea, Singapore, and the United States. UMC can be found on the web at http://www.umc.com.

About Faraday Technology Corporation

Faraday Technology Corporation is a leading fabless ASIC and silicon IP provider. The broad silicon IP portfolio includes I/O, Cell Library, Memory Compiler, ARM-compliant CPUs, DDR2/3/4, low-power DDR1/2/3, MIPI, V-by-One, MPEG4, H.264, USB 2.0/3.0, 10/100/1000 Ethernet, Serial ATA, and PCI Express, etc. Headquartered in Taiwan, Faraday has service and support offices around the world, including the U.S., Japan, Europe, and China. Faraday is listed in Taipei Stock Exchange, ticker 3035. For more information, please visit: www.faraday-tech.com.

Editorial Contacts:

UMC

Richard Yu

+886-2-2658-9168 ext. 16951

richard_yu@umc.com

Faraday

Carol Yang

+886-3-578-7888 ext.4047

htyang@faraday-tech.com

 

To view the original version on PR Newswire, visit: http://www.prnewswire.com/news-releases/umc-broadens-its-55nm-eflash-platform-with-faradays-silicon-proven-ip-300049573.html

SOURCE United Microelectronics Corporation

Contact:
United Microelectronics Corporation
Faraday Technology Corporation
Web: http://www.umc.com/




© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us
ShareCG™ is a trademark of Internet Business Systems, Inc.

Report a Bug Report Abuse Make a Suggestion About Privacy Policy Contact Us User Agreement Advertise