IPC Issues Technical Conference Participation Call for IPC APEX

IPC Issues Technical Conference Participation Call for IPC APEX EXPO 2016

Deadline for technical conference paper abstracts extended to: September 14, 2015

BANNOCKBURN, Ill., USA, August 21, 2015 — IPC — Association Connecting Electronics Industries^® invites researchers, academics, technical experts and industry leaders to submit technical conference abstracts for IPC APEX EXPO 2016 at the Las Vegas Convention Center in Las Vegas. The technical conference will be held March 15-17, 2016. The deadline for technical conference paper abstracts has been extended to September 14,^, 2015.

The world’s premier conference and exhibition for the electronic interconnect industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. To recognize exceptional achievement, awards will be presented for “Best Paper.”

Expert papers and presentations are being sought on design, materials, assembly, processes and equipment in the following areas:

Automation in Electronics Manufacturing
Adhesives
Advanced Technology
Area Array/Flip Chip/0201 Metric
Assembly and Rework Processes
BGA/CSP Packaging
Black Pad and Other Board Related Defect Issues
BTC/QFN/LGA Components
Business & Supply Chain Issues
Cleaning
Conformal Coatings
Corrosion
Counterfeit Electronics
Design
Electromigration

Embedded Passive & Active Devices
Environmental Compliance
Lean Six Sigma
LED Manufacturing
Failure Analysis
Flexible Circuitry
HDI Technologies
Electronics Manufacturing Services
Head-on-Pillow
Board and Component Warpage
High Speed, High Frequency & Signal Integrity
Lead-Free Fabrication, Assembly & Reliability
Miniaturization Nanotechnology Optoelectronics
Packaging & Components

PCB and Component Storage & Handling Performance
Quality & Reliability
Photovoltaics
PoP (Package-on-Package)
Printed Electronics
PCB Fabrication
Reshoring
RFID Circuitry
Robotics
Soldering
Surface Finishes
Test, Inspection & AOI
Tin Whiskers
2.5-D/3-D Component Packaging
Underfills
Via Plugging & Other Protection
Wearables

A 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain technical and/or appropriate test results.

To submit an abstract for the technical conference, visit www.IPCAPEXEXPO.org/CFP.

For more information about conference papers and presentations, contact Jasbir Bath, IPC conference director, at Email Contact or Toya Richardson, IPC technical programs coordinator, at Email Contact.

About IPC

IPC ( www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

Contact:

Sandy Gentry
IPC Communications Manager
+1 847-597-2871
Email Contact