35th IEEE International System-on-Chip Conference -Call for Papers

                           === CALL FOR PAPERS ===

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            = 35th IEEE International System-on-Chip Conference =

            =         Titanic Belfast, Northern Ireland         =

            =                September 5-8, 2022                =

            =                 www.ieee-socc.org                 =

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“The impact of AI/ML computing on System-on-Chip and Semiconductor Technologies”

System-on-Chip (SoC) devices, comprising digital, analog, optical, RF, and Micro-Electro-Mechanical Systems (MEMS), are the foundation of ubiquitous computing and the communication, entertainment, medical and logistics technologies underpinning emerging “Digital Societies”.

Recent advances in systems, packaging and process technologies are enabling the computation of hundreds of teraflops per chip and unleashing the massive rise of Artificial Intelligence-enabled products and applications.  This incredible demand for integration and computing per square millimetre of silicon creates new challenges with respect to storage, memory, security, reliability, power, on-chip communication, packaging and the management of design and verification. For 35 years the IEEE International System-on-Chip Conference (SOCC) has been the premier forum for sharing the latest advancements in SoC architecture, systems, logic and circuit design, process technology, test, design tools, and applications. We proudly continue this tradition with the 2022 conference at the birthplace of the Titanic in Belfast, Northern Ireland. 

Areas of Interest

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Papers are invited which address new and previously unpublished results in all areas related to SoC, including but not limited to:

  • Devices and Platforms for accelerated AI/ML computing â�¨ 
    SoCs for AI — Evolvable, adaptable, and reconfigurable architectures — Architectures for intelligent hardware systems — On-chip learning and adaption — Neuromorphic chips — Low-power and  low-area SoCs for smart IoT — Sensing, Imaging and Vision — In-memory computation — In-sensor processing

  • Emerging and Disruptive Technologies:â�¨ 
    Many-core architectures — Data processing units (DPUs) — General purpose GPU (GPGPU) computing — Embedded accelerators —  Server on a Chip — Cortical processors — Neuronal and neuromorphic computing — Beyond CMOS solutions —Quantum computing — Cloud infrastructure solutions — Futuristic development and optimization tools.
  • Design for Secure and Reliable Systems:â�¨ 
    Hardware-assisted security — Embedded security architectures — Trusted computing architectures — Cyber resilient architectures — Embedded encryption — Quantum-safe cryptography — Homomorphic encryption — SoC solutions for real-time, high reliability and safety applications — Self-healing SoCs — Soft-error and variation-tolerant design
  • Heterogeneous and Many-Core SoC Architectures:â�¨ 
    On-chip interconnect — Network on Chip (NoC) and multicore architectures — Memory architecture for multicore computing — Heterogeneous computing — High-performance mobile SoCs — Parallel programming and software models — Multi-die packaging —  Integration — Chiplets/Dielets
  • Circuits and Systems:â�¨ 
    RF, analog, mixed-signal — Biomedical — Wireline & Wireless Communication — 5G Circuits and Devices — Reconfigurable and programmable circuits — MEMS and Sensors — Photonics

  • Low Power Design:â�¨ 
    “Green” circuits & systems — Low power methodologies — Power/energy/ thermal aware architecture design —Multi-domain power/energy management — Energy harvesting

  • Design Methodologies and Development Flows:â�¨ 
    Heterogeneous design flows — Agile and Feature-Driven HW Development — HW-SW co-design, reconfiguration and debug —System level design methodology and tools — Design validation and verification — Design for Testability, test synthesis, embedded test

Submission of Papers and Special Session Proposals

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  • Regular Papers: â�¨  limited to six double-column IEEE formatted pages.â�¨  All submissions will receive a double-blind peer review. Accepted papers presented at the conference will be included in the SOCC proceedings and will be submitted for inclusion into IEEE Xplore® subject to meeting IEEE Xplore’s scope and quality requirements.
  • Industrial Papers: â�¨  one-page paper containing problem statement, importance, prior work, technical solution, and benefits optional second page with figures only. Published in the SOCC proceedings.

  • MSc/PhD Forum Papers: â�¨  two-page paper, published in the SOCC proceedings.

  • Special Session Proposals:â�¨  Must include title, topic rationale, organizer’s short bio, and a list of contributed papers. Submit directly to Email Contact.

Deadlines

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Regular and Design Track Papers:  April 15, 2022

Proposals for Special Sessions:   April 15, 2022

Notification of acceptance:       June 20, 2022

Final cameraâ�ready paper due:     July 6, 2022

For detailed formatting instructions, submission & publication guidelines, refer to www.ieee-socc.org




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