Building the IC-Substrate and Package Assembly Ecosystem
Aug 4, 2022
Registration is now open for the first IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem, to be held October 11-12, 2022, at the Kimpton Hotel Monaco in Washington, D.C. Focusing on the opportunities and challenges for next-generation advanced packaging production, the IPC Advanced Packaging Symposium offers in-depth discussions on strengthening the IC-substrate and package assembly ecosystem across North America and Europe.
“Fundamental changes in the semiconductor sector are impacting the electronics manufacturing supply chain, and lines are blurring between IC-substrate and printed circuit board fabrication and between semiconductor and electronics assembly,” said Matt Kelly, IPC chief technologist. “Understanding these industry changes will ensure the emergence of innovative, well-balanced, and resilient ecosystems to support the production of the most cutting-edge semiconductor components.”
The two-day event, which includes three keynotes, 28 speakers, and eight sessions, will bring commercial and defense electronic industry leaders together to focus on high-priority needs for IC-substrates and packaging, to identify key challenges to overcome, enabling sustainable businesses over the long run, to move past general issue awareness into actionable research, development, design, and business operations execution, and to provide attendees with actionable next steps and an expanded network for continued development efforts.
Attendees can expect:
- Speakers that span the advanced packaging ecosystem and semiconductor supply chain: component makers, HDI PCB fabricators, market-leading IC-Substrate fabricators, assembly and test manufacturers, equipment, and material suppliers.
- Three keynotes from senior leaders at Intel, Department of Defense, and TechSearch International.
- An eight-session agenda includes the latest insights from the Department of Commerce, Department of Defense, European Commission, Intel, NIST, Northrop Grumman, Raytheon, Schweizer Electronic, SEMCO, SkyWater, TechSearch International, TTM, and Western Digital among others.
For information on registration, visit: IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem.
