Ultra-Small Packaging Ideal for Applications Requiring High-Density Board Assembly - Including Mobile Devices

IRVINE, Calif., April 24, 2013 — (PRNewswire) —   Toshiba America Electronic Components, Inc., (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced the availability of a new lineup of load switch ICs for mobile devices. Featuring Toshiba's newly developed micro CMOS process, the new lineup features low voltage operation and low ON-resistance characteristics – in ultra-small packages.

The TCK101G and TCK102G are low consumption current load switch ICs with slew rate control driver for power management. Featuring low voltage operation at 1.1V and a low ON-resistance characteristics of 55m ohms (typ.) (VIN = 3.3V, IOUT = 500mA) in a 0.4mm pitch ultrasmall WCSP6 (0.8mm x 1.2mm, t: 0.64mm (max.)) package, these ICs come standard with an inrush current limiter and overtemperature protection circuit. An output auto-discharge function is also available. Toshiba's new lineup of 200mA output LDO regulators control inrush current, making them suitable for a wide range of applications including mobile phones, portable audio players, notebook PCs, DSC/DVC, and other small mobile devices.

Toshiba's TCK104G and TCK105G are load switch ICs for power management and current limit function featuring wide input voltage operation from 1.1 to 5.5V. They feature low switch ON- resistance at 65m ohms typical at 3.3V, 700mA load condition and a slew rate control driver, with thermal shutdown and an output auto-discharge function. Output current type is available, simplifying device selection and design. Available in a 0.4mm pitch ultra small package WCSP6 (0.8mm x 1.2mm x 0.64mm (max)), these devices are ideal for portable applications that require high-density board assembly – including mobile phones.

Toshiba is also offering the TCK106G, TCK107G and TCK108G which are available in the ultra-small WCSP4 package with a 0.64mm 2 footprint.  

According to Talayeh Saderi, senior business development engineer for TAEC, "Mobile devices continue to get lighter and thinner, with designers adding more and more powerful functionalities. System designers looking to accomplish all of this - while at the same time extending battery life and meeting high-density board requirements – will find Toshiba's new load switch power management ICs fit the bill perfectly."

Features include:

• Wide input voltage operation: VIN = 1.1 to 5.5V
• Low ON-resistance
• Low quiescent current:
• Low standby current: I_^Q(OFF) = 0.1 microamperes (typ) in stand-by mode
• Inrush current reducing circuit
• Thermal shutdown function
• Auto-discharge available  
• Pull down connection between CONTROL and GND
• Ultra small package: WCSP6B (0.8mm x 1.2mm x 0.64mm(max))          
                                 WCSP4 (0.79mm x .79mm x 0.5mm(typ))

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