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Real Intent to Exhibit at ARM TechCon 2013 – Booth #812

Will showcase Meridian and Ascent solutions that accelerate early functional verification and advanced RTL analysis & sign-off of electronic designs

SUNNYVALE, Calif. – Oct. 23, 2013 – Real Intent, Inc. at ARM TechCon 2013 Booth #812 next week

WHO:

Real Intent, whose comprehensive CDC verification, advanced RTL analysis and sign-off solutions eliminate complex failures in SoCs and lead the market in performance, capacity, accuracy and completeness

WHAT:

Will exhibit its Meridian™ and Ascent™ products for advanced SoC sign-off in Booth #812 at ARM TechCon 2013, in Santa Clara, Calif. These best-in-class products include: 

ARM TechCon™ is one of the fastest growing events in the industry. Up to 5,000 hardware and software engineers are expected to attend the three-day conference. The ARM® TechCon™ Expo is a unique opportunity for attendees to learn about technology solutions and innovations, identify cutting-edge technologies, and evaluate products side-by-side to help optimize designs and accelerate time-to-market launches.

WHEN/WHERE:

At the Expo on Wednesday, Oct. 30 from 10 a.m. to 7:15 p.m., and Thursday, Oct. 31 from 10 a.m. to 4 p.m. at the Santa Clara Convention Center in Santa Clara, Calif. For more information about ARM TechCon, please visit: http://www.armtechcon.com

About Real Intent
Companies worldwide rely on Real Intent’s EDA software to accelerate early functional verification and advanced sign-off of electronic designs. Real Intent’s comprehensive CDC verification, advanced RTL analysis and sign-off solutions eliminate complex failure modes of SoCs, and lead the market in performance, capacity, accuracy and completeness. Please visit www.realintent.com for more information.

Meridian and Ascent are trademarks of Real Intent, Inc. All other trademarks and trade names are the property of their respective owners.

Press contact:
Sarah Miller for Real Intent
ThinkBold Corporate Communications
231.264.8636
Email Contact