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Supermicro® Unveils New 2-Node 4U FatTwin™ Supporting 12x Intel® Xeon Phi™ Coprocessors and New TwinPro™ Platforms featuring 12Gb/s SAS 3.0 and NVMe at Supercomputing 2013

Ultra-High Density FatTwin Server Delivers Massive 144 TFLOPS of Parallel Processing Power with Maximized I/O in 42U Rack

SAN JOSE, Calif., Nov. 18, 2013 — (PRNewswire) —  Super Micro Computer, Inc. (NASDAQ: SMCI), a global leader in high-performance, high-efficiency server, storage technology and green computing, exhibits its latest high-performance computing (HPC) solutions at the Supercomputing 2013 (SC13) conference this week in Denver, Colorado. Highlighted at the show is Supermicro's innovative high-density energy efficient Twin architecture and the launch of a new 4U FatTwin platform featuring two ultra high performance compute nodes, each supporting dual Intel® Xeon® E5-2600 v2 "Ivy Bridge" processors (up to 130W TDP) and up to six Intel® Many Integrated Core (MIC) based Intel® Xeon Phi™ Coprocessors. Also making their debut are new 2U TwinPro™ and TwinPro²™ SuperServers, the second generation Twin architecture from Supermicro featuring greater memory capacity up to 16x DIMMs, 12Gb/s SAS 3.0 support, NVMe optimized PCI-E SSD interface, additional PCI-E expansion slots, 10GbE and onboard QDR/FDR InfiniBand for maximized I/O and support for a full-length, double-width Xeon Phi coprocessor per node in the 2U TwinPro. Supermicro will also highlight the 4U 4-node FatTwin SuperServer which supports up to 3x Intel Xeon Phi 5110P coprocessors paired with dual Intel Xeon E5-2600 v2 processors. This platform configured and deployed by Atipa Technologies supports the US Department of Energy's (DOE) Environmental Molecular Sciences Laboratory (EMSL) supercomputer. The EMSL HPCS-4A on the DOE's Pacific Northwest National Laboratory (PNNL) campus comprises 42x 42U rack clusters with 1,440 compute nodes and 2,880 Intel® Xeon Phi™ coprocessors, providing 3.38 petaflops theoretical peak processing speed and 2.7 petabytes of usable storage. The HPCS-4A is expected to be ranked among the world's top 20 fastest supercomputers.

Additional MIC based 1U, 2U, 3U, 4U SuperServer, FatTwin™, SuperBlade®, MicroBlade, MicroCloud, Hyper-Speed and 4-Way systems along with single/dual/multi processor (UP/DP/MP) motherboards which are the foundation of Supermicro's server Building Block Solutions® will also be on exhibit. High bandwidth 12Gb/s storage servers featuring LSI 3008 SAS3 controllers and 4U 72x hot-swap HDD bay Double-Sided Storage® servers maximize I/O performance with Intel® Cache Acceleration Software (CAS), offering dramatically enhanced performance for data-intensive HPC applications running on dedicated servers or virtual machines (VMs). Complete rack, network and server management software solutions round out the end-to-end server, network and storage solutions that can be configured and optimized to meet any scale supercomputing deployment.

"Supermicro's Twin architecture delivers maximum performance per watt, per dollar, per square foot for many supercomputing deployments with its unique combination of high performance compute density coupled with energy saving technology and highest reliability," said Charles Liang, President and CEO of Supermicro. "Indeed, we have invested a great amount of engineering effort to perfect our Twin server technology and now offer an unrivaled range of server solutions optimized for practically any scale application. With our new 4U 2-node FatTwin featuring dual Xeon CPUs and six Xeon Phi coprocessors per node, science, research and engineering programs can increase and accelerate project deliverables with maximized utilization of budget, resources and space."

"The industry is moving from experimentation with heterogeneous computing to more efficient neo-heterogeneity which combines the benefits of heterogeneous hardware while still using the same, common and standard programming models for both the CPU and co-processor," said Rajeeb Hazra, vice president and general manager of Technical Computing Group at Intel. "With solution providers such as Supermicro combining the high-performance Intel Xeon processors E5-2600 v2 with Intel Xeon Phi coprocessors in high-density, scalable server solutions, industry has the ideal pairing of technology to enable a neo-heterogeneous era. With a common underlying Intel architecture we provide developers with a rapid deployment environment for their programs along with enterprise class stability and reliability for the most demanding mission critical, compute intensive applications."

Supermicro's New HPC optimized supercomputing solutions on exhibit this week at SC'13 include:

End-to-End Scalable Computing Solutions include:

Experience Supermicro's complete range of High Performance Computing solutions at the Supercomputing 2013 Conference this week November 18th – 22nd in Denver, Colorado in the Colorado Convention Center, Booth #3132.

Supermicro solutions will also be exhibited at partner booths

Visit www.supermicro.com for additional product information.

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About Super Micro Computer, Inc.

Supermicro® (NASDAQ: SMCI), the leading innovator in high-performance, high-efficiency server technology is a premier provider of advanced server Building Block Solutions® for Data Center, Cloud Computing, Enterprise IT, Hadoop/Big Data, HPC and Embedded Systems worldwide. Supermicro is committed to protecting the environment through its "We Keep IT Green®" initiative and provides customers with the most energy-efficient, environmentally-friendly solutions available on the market.

Supermicro, SuperServer, SuperBlade, SuperRack, TwinPro, TwinPro², Double-Sided Storage, Building Block Solutions and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.

All other brands, names and trademarks are the property of their respective owners.

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SOURCE Super Micro Computer, Inc.

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