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Xilinx Experts to Highlight High-Performance 7 Series and UltraScale FPGA Designs at DesignCon 2014

Presentations and tutorials focus on increasing system performance

SAN JOSE, Calif., Jan. 22, 2014 — (PRNewswire) — Xilinx, Inc. (NASDAQ: XLNX) experts will highlight high-performance FPGA design techniques including 28Gbps backplane transceiver design, 3D stacked silicon package design, and comprehensive DDR4 signal-integrity analysis using high-performance UltraScale™ FPGA silicon and packaging at DesignCon 2014. Through a series of tutorials and paper presentations, Xilinx experts will share their insights for overcoming system-design challenges and increasing system performance. Learn more about Xilinx® UltraScale multi-Gigabit transceivers, 3D stacked silicon, and advanced signal-integrity techniques at www.xilinx.com/products/technology/index.htm and by attending Xilinx presentations and tutorials at DesignCon 2014 January 28 – 31, 2014 at the Santa Clara Convention Center in Santa Clara, CA.

Xilinx Tutorials
Tuesday, January 28, 2014 at 9:00 am12:00 pm, Ballroom K
Hands-On Tutorial for Fixture Removal of 28Gbps Tx Measurements

Tuesday, January 28, 2014 at 9:00 am12:00 pm, Ballroom E
High Density High Performance Package and 3D Interconnect Design

Tuesday, January 28, 2014 at 1:30 pm4:30 pm, Ballroom G
Relating COM to Familiar S-Parameter Parametric to Assist 25Gbps System Design

Xilinx Presentations
Wednesday, January 29, 2014 at 2:00 pm2:40 pm, Ballroom J
Touchstone v2.0 SI/PI S-Parameter Models for Simultaneous Switching Noise

Wednesday, January 29, 2014 at 2:00 pm2:40 pm, Ballroom E
Distributed Modeling and Characterization of On-Chip/System Level PDN and Jitter Impact

Thursday, January 30, 2014 at 9:20 am10:00 am, Ballroom C/D
Method for Analytically Calculating BER (Bit Error Rate) in Presence of Non-Linearity

Thursday, January 30, 2014 at 10:15 am10:55 am, Ballroom F
Model Extraction and Circuit Simulation Approaches for Successful SSO Analysis of Chip-Package-Board Systems

Thursday, January 30, 2014 at 11:05 am11:45 am, Ballroom C/D
High Speed Serial Link Simulation Based on Dynamic Modeling

Thursday, January 30, 2014 at 2:50 pm3:30 pm, Ballroom E
Comprehensive Full-Chip Methodology to Verify Electromigration and Dynamic Voltage Drop on High Performance FPGA Designs in the 20nm Technology

Friday, January 31, 2014 at 10:40 am11:20 am, Ballroom H
De-Mystifying the 28 Gb/s SERDES Channel - Design to Measurement

About Xilinx

Xilinx is the world's leading provider of All Programmable FPGAs, SoCs and 3D ICs. These industry-leading devices are coupled with a next-generation design environment and IP to serve a broad range of customer needs, from programmable logic to programmable systems integration. For more information, visit www.xilinx.com.

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SOURCE Xilinx, Inc.

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