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Broadcom Announces Industry's First 25G IEEE 802.3bj Compliant Lite-PHYs

New Low Power Lite-PHYs Support Next Generation 100 Gigabit Switches with 4X25G Backplane and Line Cards

SAN FRANCISCO, March 10, 2014 — (PRNewswire) —  OFC Technical Conference 2014 - Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced the industry's first IEEE 802.3bj compliant physical layer devices (Lite-PHYs). Designed for the next generation 100G datacenter and enterprise front panel and backplane interconnect applications, the low-power 28 nanometer (nm) BCM8207x and BCM8238x Lite-PHYs support 4X25G backplane and line cards for the rollout of 100 Gigabit per second (Gbps) switches. For more news, visit Broadcom's Newsroom.

Developed in response to the rapid growth of server, network and internet traffic, the IEEE 802.3bj standard meets the need for higher data rates over backplanes and copper cables for 100 Gbps throughput. The new generation of low-power high density PHYs enables customers to design IEEE 802.3bj-compliant 100G products that support 100GBase-CR4/SR4/LR4 on the front panel and 100GBase-KR4 on the backplane.

"Broadcom's latest Lite-PHY devices pave the way for the development of 100 Gbps switches that support the high speed requirements of the most technologically-advanced cloud and mobility infrastructure environments as well as rich video content," said Lorenzo Longo, Broadcom Vice President and General Manager of Physical Layer  Products.  "Our 802.3bj compliant Lite-PHYs enable OEMS and carriers to meet ever increasing traffic requirements by providing the needed performance and low power efficiency."

The BCM8207x and BCM8238x are low power and integrate high performance equalizer functions to support 100 Gigabit over Ethernet (GbE), as well as 10 GbE and 40 GbE applications. The BCM8207x Lite-PHY is optimized to enable high bandwidth and dense backplane interconnect while the BCM8238x Lite-PHY is optimized to drive CFP2/CFP4/QSFP28 optical modules.

The BCM8207x and BCM8238x integrate AC-coupling capacitors on all high-speed receivers. Adaptive equalization on both the host and line side interfaces compensate for channel loss across long PCB traces and across backplanes and twin-ax DAC cables. The devices include support for IEEE 802.3bj Clause 91 Forward Error Correction (FEC) standard.

Key Features:

BCM8207x

BCM8238x

Availability

The BCM8207x and BCM8232x are now sampling. See Broadcom's portfolio of networking solutions for data center and enterprise on the OFC show floor at booth #530 located in the Corporate Village 2. 

About Broadcom

Broadcom Corporation (NASDAQ: BRCM), a FORTUNE 500® company, is a global leader and innovator in semiconductor solutions for wired and wireless communications. Broadcom® products seamlessly deliver voice, video, data and multimedia connectivity in the home, office and mobile environments. With the industry's broadest portfolio of state-of-the-art system-on-a-chip solutions, Broadcom is changing the world by Connecting everything®. For more information, go to www.broadcom.com.

Broadcom®, the pulse logo, Connecting everything® and the Connecting everything logo are among the trademarks of Broadcom Corporation and/or its affiliates in the United States, certain other countries and/or the EU.  Any other trademarks or trade names mentioned are the property of their respective owners.

Contacts

Press

Jyotsna Grover

Manager, Product Communications

408-919-4274

jyotsnag@broadcom.com

Investors

Chris Zegarelli

Senior Director, Investor Relations

949-926-7567

czegarel@broadcom.com

 

SOURCE Broadcom Corporation; BRCM Infrastructure & Networking

Contact:
Broadcom Corporation
BRCM Infrastructure & Networking
Web: http://www.broadcom.com