SAN JOSE, Calif. — (BUSINESS WIRE) — April 21, 2014 — Tessera Technologies, Inc. (Nasdaq: TSRA), announced today that Invensas Corporation, its wholly owned subsidiary, and Seoul, South Korea-based STS Semiconductor & Telecommunications Co. Ltd. (KRX: 036540), a leading semiconductor assembly and test solution provider specializing in mobile and communication devices, have entered into an agreement to validate high volume manufacturing capability for Invensas’ Bond Via Array (BVA^TM) technology for next generation smartphone and tablet customers.

BVA is a proven advanced Package-on-Package (PoP) technology for System on Chip (SOC) and memory integration in mobile devices. Styled as a “Bridge Technology to 3DIC”, it is a unique solution that utilizes established wire-bond assembly techniques to enable low power and high-bandwidth (1000 IO+) packaging in an ultra-small form factor, ideal for mobile devices. STS’s state of the art engineering and worldwide high-volume capabilities provide an ideal platform for high volume manufacturing of BVA.

“We are delighted to partner with Invensas on BVA,” stated Chang-Bum Shim, Chief Operating Officer and Executive Vice President for STS. “STS understands the critical need to increase interconnect bandwidth for the growing Package-on-Package mobile SOC market, without increasing product size or the cost to the end user. Our engineering and manufacturing capabilities are ideally suited to the commercialization of BVA.”

“STS is an ideal partner for BVA,” said Simon McElrea, CTO of Tessera Technologies, Inc. and President of Invensas. “Their continual investment in cutting-edge packaging technology and associated manufacturing capability, coupled with their growth model in mobile and communication devices, is perfectly aligned for BVA commercialization.”

Learn more about BVA technology at: www.invensas.com.

Safe Harbor Statement

This document contains forward-looking statements, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements involve risks and uncertainties that could cause actual results to differ significantly from those projected, particularly with respect to the impact of the agreement with STS and features, benefits, characteristics and future commercial adoption of BVA. Material factors that may cause results to differ from the statements made include the plans or operations relating to the businesses of Tessera Technologies, Inc. (the “Company”); market or industry conditions; changes in patent laws, regulation or enforcement, or other factors that might affect the Company’s ability to protect or realize the value of its intellectual property; the expiration of license agreements and the cessation of related royalty income; the failure, inability or refusal of licensees to pay royalties; initiation, delays, setbacks or losses relating to the Company's intellectual property or intellectual property litigations, or invalidation or limitation of key patents; the timing and results, which are not predictable and may vary in any individual proceeding, of any ICC ruling or award, including in the Amkor arbitration; fluctuations in operating results due to the timing of new license agreements and royalties, or due to legal costs; the risk of a decline in demand for semiconductor and camera module products; failure by the industry to use technologies covered by the Company's patents; the expiration of the Company's patents; the Company's ability to successfully complete and integrate acquisitions of businesses; the risk of loss of, or decreases in production orders from, customers of acquired businesses; financial and regulatory risks associated with the international nature of the Company's businesses; failure of the Company's products to achieve technological feasibility or profitability; failure to successfully commercialize the Company's products; changes in demand for the products of the Company's customers; limited opportunities to license technologies and sell products due to high concentration in the markets for semiconductors and related products and camera modules; the impact of competing technologies on the demand for the Company's technologies and products; and the reliance on a limited number of suppliers for the components used in the manufacture of DOC products. You are cautioned not to place undue reliance on the forward-looking statements, which speak only as of the date of this release. The Company's filings with the Securities and Exchange Commission, including its Annual Report on Form 10-K for the year ended Dec. 31, 2013, include more information about factors that could affect the Company's financial results. The Company assumes no obligation to update information contained in this press release. Although this release may remain available on the Company's website or elsewhere, its continued availability does not indicate that the Company is reaffirming or confirming any of the information contained herein.

About Tessera and Invensas

Tessera Technologies, Inc. and Invensas Corporation, its wholly owned subsidiary, (Nasdaq: TSRA - News), are global leaders in semiconductor interconnect solutions and intellectual property. We innovate in areas such as mobile computing and communications, memory and data storage, and 3-D Integrated Circuit (3DIC) technologies. We are headquartered in San Jose, California, and license our solutions to Original Equipment Makers, Original Design Manufacturers, and Integrated Device Manufactures and deliver the products to market through collaborative engineering partnerships and strategic business alliances. Learn more at www.interconnectology.com or www.invensas.com, or contact our press relations at +1 408 324 5105.

Invensas, the Invensas logo, Tessera, the Tessera logo and BVA are trademarks or registered trademarks of affiliated companies of Tessera Technologies, Inc. in the United States and other countries. All other company, brand and product names may be trademarks or registered trademarks of their respective companies.

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