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New feature enhancements with the Asscon VP800 increases process efficiencies

Longmont, CO, January 9, 2015:  A-Tek Systems Group is pleased to announce the re-release of the Asscon VP800, now configured with the standard feature, Sensor Based Profiling.

Assemblies to be soldered are placed on the VP800 work piece carrier in the loading zone and transported automatically into the soldering zone. Various assemblies can be soldered simultaneously by maximizing the enlarged 460 x 610 mm process window to optimize the process cycle time. As the assemblies transfer from the load zone to the vapor zone, the heated vapor will condensate on the assemblies initiating the heat transfer. Using the new Sensor Based Profiling feature, it is now possible to set the temperature profile to either linear or step profile.  

Sensor based profiling monitors the temperature measurement of each soldering cycle on the product level and the automatic control of the soldering profile. The temperature sensor is heated together with the solder product in the system and is used as a set point for the active process control. This parallel measurement corresponds with the profiles at the sensor. With the Sensor Based Profiling feature, it possible to detect nondestructive temperature and heating behaviors of the product.

Benefits of Solder Based Profiling:

A-Tek Systems Group was established in 2004 to market high quality, value-add PCB assembly equipment. A-Tek is the National Distribution partner for Asscon. Other products marketed by A-Tek include PCB depaneling (Getech), Selective Soldering (Ebso) and PCB Cleaning (Kolb). Headquartered out of Longmont CO, A-Tek provides 24/7 technical support and spare parts to customers in North America, Canada and Mexico.


Contact:

Patty Chonis
President
A-Tek Systems Group
Tel:970-532-5100 
Fax:970-532-5101
Mob:970-443-9233
EM: Email Contact