Vila do Conde, Porto, Portugal – Jan 14, 2015 – NANIUM S. A., acknowledged for its semiconductor packaging proficiency, today presented a solution that integrates 10 dies side-by-side in a 2 x 5 array. Featuring an outer package dimension of 33 x 28 mm2, this Wafer-Level Multi-Chip Module fully relied on the Fan-Out/eWLB technology that is NANIUM’s hallmark. The solution leveraged the eWLB processing capability in standard wafer-level equipment, successfully balancing dielectric and mold compound stress to create an extremely flat module. The final unit is incorporated within an ultra-compact medical device for visualizing vasculature and guiding peripheral intravenous access.
“This is the most complex solution we have ever developed for Medical applications. The small-form factor achieved is unprecedented and the unit’s performance largely surpassed our client’s requirements –at mechanical, electrical and thermal level” explains Eoin O’Toole, NANIUM’s senior integration engineer responsible for the packaging concept. “Our eWLB technology was key to this accomplishment, as it meets high performance demands while also offering one of the highest system integration densities commercially available in the industry”.
The final package’s 10 dies, inter-connected by edge die pads, have only 200 µm between them. As not only size, but also thickness was one of the main concerns voiced by the customer, thin-film technology process RDL (Redistribution Layer) was chosen in place of the previously considered flex substrate, and micro pillars were found as an alternative to conventional BGA solder ball bumping. The final units have 6,000 Cu/Ni/Au micro pillars with 200 µm diameter, 300 µm pitch and 10 µm height.
NANIUM’s Multi-Chip Module is an integral component of Analogic’s Sonic Window® handheld ultrasound device. It is the first application of this type of dense array module in a medical device.
“The ultra-compact, pocket-sized, Sonic Window is unlike any portable ultrasound device available on the market today,” said Jim Green, Analogic’s president and chief executive officer. “We are addressing an unmet need to bring clinicians better vascular access and care to challenging patients in their practices. Integrating all this processing capacity in such an extremely small space was a critical requirement. We were impressed with NANIUM’s capabilities in core areas such as package research, development, test and manufacture.”
eWLB is a Fan-Out Wafer-Level Packaging (FOWLP) technology that relies on reconstituted wafers and allows for efficient embedded integration of several active and passive dies. It allows for superior electrical performance and for attaining minimal small-form factor and package/size. It currently is one of the major technology drivers in embedded Wafer-Level Packaging.
About NANIUM
NANIUM is a world-class provider of semiconductor assembly, packaging, test, engineering and manufacturing services. The company started as Siemens Semiconductors back in 1996 and nowadays is a leader in 300mm Wafer-Level Packaging (WLP), both Fan-In/WLCSP and Fan-Out/eWLB.
NANIUM offers in-house capabilities for the entire development chain, from design to multiple Wafer-Level Packaging technologies, and the flexibility to tailor and test solutions that respond to the most demanding customer requirements. The company is based near Porto, Portugal, and has an office in Dresden, Germany. More information on NANIUM available at www.nanium.com.
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About Analogic
Analogic (Nasdaq:ALOG) provides leading-edge healthcare and security technology solutions to advance the practice of medicine and save lives. We are recognized around the world for advanced imaging and real-time guidance technologies used for disease diagnosis and treatment as well as for automated threat detection. Our market-leading ultrasound systems, led by our flagship BK Ultrasound brand, used in procedure-driven markets such as urology, surgery, and point-of-care, are sold to clinical practitioners around the world. Our advanced imaging technologies are also used in computed tomography (CT), magnetic resonance imaging (MRI) and digital mammography systems, as well as automated threat detection systems for aviation security. Our imaging technology can be found in over half of the CT and MRI systems installed worldwide. Analogic is headquartered just north of Boston, Massachusetts. For more information, visit www.analogic.com.