Vila do Conde, Porto, Portugal – 10th June 2015 – NANIUM S.A., a leading provider of advanced semiconductor packaging known for its innovative solutions, today announced it achieved outstanding reliability results for a Wafer-Level Chip Scale Package (WLCSP) without the typically applied Under Bump Metallization (UBM). The product, with a package of 5.8 x 5.4 mm2, endured over 1,000 TCoB, a reliability milestone for a UBM-less WLCSP package that reflects the company’s know-how in both WLCSP and Wafer-Level Fan-Out (WLFO) technologies.
“This is a remarkable achievement that reflects the intense development work we have been carrying out at NANIUM”, explained Vitor Chatinho, NANIUM’s senior integration engineer responsible for the project. “The reliability results we achieved without UBM translate into a shorter manufacturing cycle time of the products, as well as a clear cost advantage. This is an outbreak that positions WLCSP technology as one the most cost-efficient in the market without reliability compromise.”
NANIUM was among the first in the world to offer WLFO in high volume manufacturing and, indeed, the company’s expertise in WLFO process were key to the development of this solution. This new qualified solution required a thorough knowledge and fine-tuning of WLCSP material characteristics and package design, something that the company had already attained upon their work for qualifying the world’s largest WLCSP package in 2014.
The new WLCSP packages, developed for a product in the mobile market, are an optimal configured combination of material, process and design elements. They have exceeded 1,000 cycles in the temperature cycling on board test (TCoB @ -40 to 125 °C), performed according to IPC-9701 (condition TC3) standard, while also exceeding 200 drops in the Board Level Drop Test performed according to the JEDEC JESD22-B111 standard. These results were considered excellent, as UBM generally is an essential element in the package construction of WLCSP to achieve these reliability levels.
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WLCSP is a Fan-In technology that offers the highest electrical/thermal performance, as well as the smallest package form-factor possible in the semiconductor packaging industry. It enables low-cost manufacturing for product applications such as Mobile and Consumer products, Wireless connectivity, MEMS and Sensors.
NANIUM will be showcasing this WLCSP solution at Semicon West, along with its other wafer-level packaging technology innovations. The event will be held in San Francisco, California, USA, from July 14th to July 16th, 2015.Â
About NANIUM
NANIUM (www.nanium.com) is an outsourced semiconductor packaging, assembly and test provider, and a world-leader in 300mm Wafer-Level Packaging. The company provides Wafer-Level Chip Scale Packaging (WLCSP) and was among the first in the world to offer Wafer-Level Fan-Out (WLFO) packaging in high volume manufacturing. Nowadays, NANIUM stands as a leader in WLFO, a technology that combines minimal form-factor with superior performance, high integration density, and maximum reliability. To date, NANIUM has shipped over 550 million WLFO packages.
NANIUM delivers world-class services and always customizes them according to the customers’ needs. In this way, its WLFO embedded integration solutions range from single- to multi-die, system-in-package and package-on-package with passives integration, and serve markets such as mobile communication, medical, security, wearables and automotive radars, to name a few. The company is acknowledged for its proficiency in advanced packaging and known for its portfolio of innovative solutions, which includes the largest WLCSP in the world or the most compact WLFO Multi-Chip Module in the medical market.
Based in Portugal, NANIUM’s facilities include over 20,000 m2 of cleanroom area. The company offers in-house capabilities for the entire development chain, from design to the flexibility to tailor and test solutions. NANIUM has sales offices in Dresden, Germany, and Boston, USA.
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Company Contact:
Irene Martins
NANIUM, S.A.
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