3D XPoint technology will sample later this year with select customers, and Intel and Micron are developing individual products based on the technology.

Multimedia Elements:

For additional information, visit:

• Media Kit – Micron / Intel

Contribute to the memory technology conversations through Intel’s social channels:

• IT Peer Network Blogs: communities.intel.com/community/itpeernetwork/blog
• Facebook*: www.facebook.com/Intel
• Twitter*: www.twitter.com/IntelSSD
• YouTube*: www.youtube.com/user/channelintel

Take part in Micron’s social conversations where we’re talking all things storage and memory:

• Innovations Blog: www.micronblogs.com
• Twitter*: www.twitter.com/micronstorage
• YouTube*: www.youtube.com/microntechnology

Intel

Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com, and about Intel’s conflict-free efforts at conflictfree.intel.com.

Micron Technology, Inc.

Micron Technology, Inc., is a global leader in advanced semiconductor systems. Micron’s broad portfolio of high-performance memory technologies—including DRAM, NAND and NOR Flash—is the basis for solid state drives, modules, multichip packages and other system solutions. Backed by more than 35 years of technology leadership, Micron’s memory solutions enable the world’s most innovative computing, consumer, enterprise storage, networking, mobile, embedded and automotive applications. Micron's common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com

©2015 Micron Technology, Inc. All rights reserved. Micron and the Micron orbit logo are trademarks of Micron Technology, Inc.

Intel and 3D XPoint are trademarks of Intel Corporation in the U.S. and/or other countries.

*All other trademarks are the property of their respective owners.

This document contains forward looking statements. Forward looking statements are predictions, projections and other statements about future events that are based on current expectations and assumptions and, as a result, are subject to risks and uncertainties. Many factors could cause actual results to differ materially from the forward-looking statements in this document. A detailed discussion of the factors that could affect Intel’s results and plans is included in Intel’s SEC filings, including the annual report on Form 10-K.

¹ Performance difference based on comparison between 3D XPoint technology and other industry NAND
² Density difference based on comparison between 3D XPoint technology and other industry DRAM
³ Endurance difference based on comparison between 3D XPoint technology and other industry NAND
⁴ http://www.emc.com/leadership/digital-universe/2014iview/executive-summary.htm

View source version on businesswire.com: http://www.businesswire.com/news/home/20150728005534/en/

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Contact:

Intel Corporation
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Micron Technology
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