Upcoming SmartFusion2 Data Security Webinar will demonstrate how to leverage SmartFusion2 to design a secure system
PHOENIX & ALISO VIEJO, Calif. — (BUSINESS WIRE) — January 19, 2016 — Avnet, Inc. (NYSE: AVT), a leading global technology distributor, and Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced that Avnet has updated its design software on the SmartFusion™2 KickStart Development Kit to offer a data security demonstration. The kit, sold exclusively through Avnet, is an entry-level development platform designed to facilitate rapid prototyping using Microsemi’s SmartFusion2 system-on-chip (SoC) field programmable gate arrays (FPGAs).
The SmartFusion2 KickStart Development Kit’s board features Microsemi’s low-power, single event upset (SEU)-immune SmartFusion2 SoC FPGA, a secure and integrated programmable device with 10,000 logic elements and a 166 MHz ARM® Cortex®-M3 processor. The kit is ideal for customers utilizing Microsemi’s SmartFusion2 in Internet of Things (IoT), industrial networked equipment, medical networked products and other applications that require the highest levels of data communications security. A Windows app is used to control and view the steps to establish a secure Bluetooth Low Energy connection between a SmartFusion2 “server” and an Android “client.” The SmartFusion2 KickStart Development Kit is one of three Avnet-designed solutions named by EDN magazine as the top 100 Hot Products of 2015.
Customers interested in learning more about how to leverage the security features of the SmartFusion2 device to design a secure system can attend the Microsemi SmartFusion2 Data Security Webinar, Feb. 3, 2016 from 8 a.m.-9 a.m. (PST).
“The data security reference design for the KickStart Kit provides an easy-to-follow implementation of basic security building blocks,” said Stefan Rousseau, senior technical marketing engineer for Avnet. “Designers who are new to design for security should be able to understand and re-use the given examples, while others who are already familiar with these concepts will see how the secure elements and architecture of the SmartFusion2 SoC are used for securing the system.”
According to the Aberdeen Group, by the year 2020 approximately 50 billion machines will be connected. Not only do these machines need to be secure, but they need to be secured at the device, design and system levels. The versatile SmartFusion2 KickStart Kit offers engineers the much-needed low-power, high-security and reliability required to protect data and valuable application intellectual property in today’s IoT-enabled devices.
“Our newly available demonstrations of the SmartFusion2 KickStart Development Kit not only showcase its excellent data security capabilities, but they also demonstrate the feature-rich architecture of the SmartFusion2,” said Ted Marena, director of SoC/FPGA marketing at Microsemi. “Customers can easily implement a broad range of applications and secured data communication by leveraging this unique, low-cost development platform and software.”
Features of the SmartFusion2 KickStart Development Kit data security demonstration include:
- Basic terminology for key usage and management
- Using certificates and public key infrastructure
- Establishing a secure channel using the Diffie-Hellman key agreement
- Using symmetric keys once authentication has completed
To purchase the SmartFusion2 KickStart Kit or to download the data security reference design update, click here. To register for the Microsemi SmartFusion2 Data Security Webinar, click here. To see videos of the kit, visit http://www.microsemi.com/products/fpga-soc/design-resources/dev-kits/smartfusion2/kickstart-kit.
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About Microsemi’s SmartFusion2 SoC FPGAs
Microsemi's SmartFusion2 SoC FPGAs deliver more resources in low density devices, with the lowest power, proven security and exceptional reliability. These devices are ideal for general purpose functions such as Gigabit Ethernet or dual PCI Express control planes, bridging functions, input/output (I/O) expansion and conversion, video/image processing, system management and secure connectivity. Microsemi SoC FPGAs are used by customers in communications, industrial, medical, defense, and aviation markets. PCIe Gen 2 connectivity starts at just 10K logic elements (LEs). SmartFusion2 SoC FPGAs offer 5K-150K LEs with 166MHz ARM Cortex-M3 processor with up to 512KB of embedded flash, triple-speed Ethernet, USB 2.0 OTG, CAN controllers and general purpose peripherals, with the highest max I/O per LE density. Microsemi also offers a broad range of military, automotive and space grade FPGAs and SoC FPGAs. For more information visit: http://www.microsemi.com/products/fpga-soc/soc-fpga/smartfusion2.
About Microsemi
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world’s standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Ethernet solutions; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,600 employees globally. Learn more at www.microsemi.com.
About Avnet, Inc.
From components to cloud and design to disposal, Avnet, Inc. (NYSE: AVT) accelerates the success of customers who build, sell and use technology globally by providing them with a comprehensive portfolio of innovative products, services and solutions. Avnet is a Fortune 500 company with revenues of $27.9 billion for the fiscal year 2015. For more information, visit www.avnet.com.
"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to Avnet updating its design software on the SmartFusion™2 KickStart Development Kit to offer a data security demonstration, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.
Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.
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