Title: Rethinking System Architectures: The Shifting Performance
Bottlenecks Driving Future Silicon Design
Date: Wednesday,
January 20, 2016
Time: 9:20 am - 10:00 am and 2:00 pm - 2:40
pm
Topic: Moore’s Law has relentlessly delivered tremendous
improvements in processing performance and functionality for several
decades, enabling newer generations of processors to surpass the
capabilities of their predecessors. While processors will continue to
become more feature-rich, the emergence of new computing paradigms and
slower rates on improvement in other areas mean that power and
performance bottlenecks moving away from processors into others
subsystems. Moving data between processing elements, memory, storage and
across networks is becoming a growing challenge, and concerns about
power and security are forcing chip and system architects to rethink not
only how silicon needs to be architected, but systems as a whole. In
this talk, Rambus discuss how these concerns are driving changes in the
way we think about both silicon and systems in the future.
Speaker:
Steven Woo, VP, Solutions Marketing and Distinguished Inventor, Rambus
Inc.
Title: Which SerDes to Choose: System Tradeoffs For High-speed
Serial Link Selection
Date: Wednesday, January 20, 2016
Time:
10:15 am - 10:55 am and 2:50 pm - 3:30 pm
Topic: With the
new era of every device getting smart and data getting bigger, there has
been a constant increase in bandwidth and speed requirements for
networking communications on the back end side. From the age of chips
communicating at 1Gbps to 10Gbps to 40Gbps to 100Gbps and setting the
stage for 400Gbps and 1Tbps in coming years, everyone wants to
communicate faster and faster but at the same time by being more
efficient (energy consumption) and smaller (silicon area). With the new
technology nodes trending even faster than Moore’s law, there are
variety of dimensions and tradeoffs which are required to define a
Serial link for the next generation needs to make a particular solution
effective on all fronts.
Speaker: Mohit Gupta, Director,
Product Marketing, Rambus Inc.
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About Rambus Inc.
Rambus creates cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting. Our chips, customizable IP cores, architecture licenses, tools, services, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile, consumer and media platforms. At Rambus, we are makers of better. For more information, visit rambus.com.
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View source version on businesswire.com: http://www.businesswire.com/news/home/20160119006816/en/
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