Automotive and Discrete Group (ADG)

• Awarded a complete anti-lock brake chipset, including a 32-bit microcontroller, for a motorbike application from a major Japanese tier1;
• Continued expansion of 32-bit automotive microcontroller business with a major award from a Japanese tier 1 for a networking gateway with embedded security;
• Landed a win for a next-generation airbag smart-power chipset from two major Japanese tier 1 players for a leading Japanese carmaker;
• Earned awards for class AB amplifiers from major tier 1s for multiple infotainment head-unit applications for a leading American carmaker;
• Recorded important design-wins for ESD protection devices from smartphone and wearable market leaders in the US and Asia;
• Collected multiple design wins for common-mode filters and high-speed HDMI protection devices with tablet and PC market leaders;
• Won multiple designs from several players for super-junction and SiC MOSFET product families across a range of applications including servers, solar, gaming systems, and dc/dc converters;
• Started a collaboration with a major Japanese tier 1 for a surround-view camera system;
• Announced the development of the 5^th generation system-on-chip for Mobileye in sub-10nm technology.

Analog and MEMS Group (AMG)

       MEMS & Sensors

• Ramped production of 6-axis ultra-low-power MEMS accelerometer and gyroscope, optical-image-stabilization gyroscope, and barometric sensor for latest Samsung Galaxy smartphones, including Samsung Galaxy S7 and S7 edge;
• Booked multiple Automotive design wins for custom MEMS accelerometer in Japan and for 3-axis automotive gyroscope from a top tier-1 supplier for an American manufacturer;
• Landed multiple design wins for 6-axis single- and dual-core inertial measurement units for user interface and optical image stabilization from numerous Chinese manufacturers and for applications like sportwatches from wearable players;
• Increased presence in optical image stabilization with our latest low-noise gyroscope;
• Announced collaboration with Qualcomm on sensors for smart mobile devices;
• Awarded socket for ultra-low-power, high performance 3-axis accelerometer for anti-tampering protection in smart meters;
• Ramped production of newest pressure sensor for wearable and smartphone applications for leading Asia-Pacific suppliers;
• Launched production of ultra-low-power smart accelerometer with embedded pedometer for a Chinese manufacturer and for a children's watch application.

       Analog

• Initiated volume production of next-generation smart meters for Enel;
• Introduced latest-generation single-chip Bluetooth Low Energy Chip (SoC) that delivers a performance edge at a cost-effective price;
• Ramped shipments of latest motion-control chip (STSPIN) for a new high-performance drone from a well-known Chinese manufacturer;
• Began production of wireless-charger IC for an edgy, youth-targeted smart watch;
• Continued proliferation of latest-generation touchscreen sensor with multiple design wins for mobile applications in China and Asia Pacific.

Microcontrollers and Digital ICs Group (MDG)

• Made significant progress in the drone market with STM32 family design-ins from several major drone manufacturers for in-flight and motor control;
• Captured design-in for STM32F0 at a major European lighting manufacturer;
• Won an FD-SOI ASIC design from a major Japanese player;
• Recorded several 55nm BiCMOS design wins, including a trans-impedance amplifier at a major Chinese ASIC house and two ASICs from a leading network optical module supplier;
• Began production ramp of dynamic NFC tags along with high-density EEPROMs for a major European smart-meter program;
• Ramped production of ST's first silicon photonic transceiver for a networking module manufacturer to upgrade a leading datacenter operator to 100Gbit/sec;
• Started H9 RF-SOI volume production for a smartphone Front-End Module (FEM) ASIC for a Chinese customer;
• Achieved milestone two billionth STM8 units shipped, less than two years after passing the one billion unit mark in May 2014;
• Launched cooperation with Arduino to expand maker-community access to STM32 MCUs;
• Revealed a cooperation with Securitag Assembly Group (SAG) to deliver high-performance, tiny NFC tags for IoT applications;
• Unveiled USB Type-C 1.2 and USB Power Delivery 2.0 middleware stack for the STM32;
• Announced free development tools to enable STM32 developers access from all desktops environments (Linux and OS-X, in addition to Windows);
• Qualified and certified to Common Criteria the ST31G480 dual-interface secure microcontroller;
• Introduced the STSAFE-A100 secure element to protect connected devices in the Internet of Things (IoT) and certified STSAFE-TPM (Trusted Platform Module) to Common Criteria and TCG 1.2 & 2.

Imaging Product Division (IMD)

• Recorded multiple design-wins for the just-announced VL53L0 Time-of-Flight ranging sensor for auto-focus applications in the flagship smartphones of Huawei and other leading Asian manufacturers.

Use of Supplemental Non-U.S. GAAP Financial Information

This press release contains supplemental non-U.S. GAAP financial information, including operating income (loss) before impairment and restructuring charges, operating margin before impairment and restructuring charges, adjusted net earnings per share, free cash flow and net financial position.

Readers are cautioned that these measures are unaudited and not prepared in accordance with U.S. GAAP and should not be considered as a substitute for U.S. GAAP financial measures. In addition, such non-U.S. GAAP financial measures may not be comparable to similarly titled information by other companies.

See the Appendix of this press release for a reconciliation of the Company's non-U.S. GAAP financial measures to their corresponding U.S. GAAP financial measures. To compensate for these limitations, the supplemental non-U.S. GAAP financial information should not be read in isolation, but only in conjunction with the Company's consolidated financial statements prepared in accordance with U.S. GAAP.

Forward-looking information

Some of the statements contained in this release that are not historical facts are statements of future expectations and other forward-looking statements (within the meaning of Section 27A of the Securities Act of 1933 or Section 21E of the Securities Exchange Act of 1934, each as amended) that are based on management's current views and assumptions, and are conditioned upon and also involve known and unknown risks and uncertainties that could cause actual results, performance, or events to differ materially from those anticipated by such statements, due to, among other factors:

• Uncertain macro-economic and industry trends, which may impact end-market demand for our products;
• Customer demand that differs from projections;
• The ability to design, manufacture and sell innovative products in a rapidly changing technological environment;
• Unanticipated events or circumstances, which may impact our ability to execute the planned reductions in our net operating expenses and / or meet the objectives of our R&D Programs, which benefit from public funding;
• Changes in economic, social, labor, political, or infrastructure conditions in the locations where we, our customers, or our suppliers operate, including as a result of macro-economic or regional events, military conflicts, social unrest, labor actions, or terrorist activities;
• The Brexit vote and the perceptions as to the impact of the withdrawal of the U.K. may adversely affect business activity, political stability and economic conditions in the U.K., the Eurozone, the EU and elsewhere. While we do not have material operations in the U.K. and have not experienced any material impact from Brexit on our underlying business to date, we cannot predict its future implications;
• Financial difficulties with any of our major distributors or significant curtailment of purchases by key customers;
• The loading, product mix, and manufacturing performance of our production facilities;
• The functionalities and performance of our IT systems, which support our critical operational activities including manufacturing, finance and sales, and any breaches of our IT systems or those of our customers or suppliers;
• Variations in the foreign exchange markets and, more particularly, the U.S. dollar exchange rate as compared to the Euro and the other major currencies we use for our operations;
• The impact of intellectual property ("IP") claims by our competitors or other third parties, and our ability to obtain required licenses on reasonable terms and conditions;
• The ability to successfully restructure underperforming business lines and associated restructuring charges and cost savings that differ in amount or timing from our estimates;
• Changes in our overall tax position as a result of changes in tax laws, the outcome of tax audits or changes in international tax treaties which may impact our results of operations as well as our ability to accurately estimate tax credits, benefits, deductions and provisions and to realize deferred tax assets;
• The outcome of ongoing litigation as well as the impact of any new litigation to which we may become a defendant;
• Product liability or warranty claims, claims based on epidemic or delivery failure, or other claims relating to our products,  or recalls by our customers for products containing our parts;
• Natural events such as severe weather, earthquakes, tsunamis, volcano eruptions or other acts of nature, health risks and epidemics in locations where we, our customers or our suppliers operate;
• Availability and costs of raw materials, utilities, third-party manufacturing services and technology, or other supplies required by our operations.