DesignCon 2018 Call for Papers
DesignCon returns to the Santa Clara Convention Center on January 30- February 1, 2018. Call for Papers will begin in mid-May with submissions due by the mid-July, 2017 deadline. To stay updated on next year's event, visit: designcon.com

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About DesignCon
DesignCon is the world's premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board and systems designers in the country.  This three-day technical conference and expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry's leading experts and solutions providers. More information is available at: designcon.com/santaclara. DesignCon is organized by UBM Americas, a part of UBM plc (UBM.L), an Events First marketing and communications services business. For more information, visit ubmamericas.com.

About UBM Americas 
UBM Americas, a part of UBM plc, is the largest business-to-business events and trade show organizer in the U.S. Through a range of aligned interactive physical and digital environments, UBM Americas increases business effectiveness for both customers and audiences by cultivating meaningful experiences, knowledge and connections. UBM Americas has offices spanning North and South America, and serves a variety of specialist industries with dedicated events and marketing services covering everything from fashion, tech and life sciences to advanced manufacturing, cruise shipping, specialty chemicals, powersports and automotive, concrete, hospitality, cargo transportation and more. For more information, visit: www.ubmamericas.com. 

To view the original version on PR Newswire, visit: http://www.prnewswire.com/news-releases/designcon-celebrates-more-than-40-professionals-with-2017-awards-for-best-papers-300440651.html

SOURCE UBM Americas