“Expanding the SpiFlash family to include very-low-voltage serial flash memories gives designers the ability to create systems that save significant power and materials cost,” said JW Park, VP of Flash Memory Marketing at Winbond Electronics Corporation America. “Winbond developed these 1.2V and 1.5V low-voltage families to give designers the additional capability of having a single, small-footprint design that can span across the full range of densities -- from 1Mb through 128Mb.”
To ensure meeting the growing global demand for high-volume solutions, Winbond SpiFlash memories are manufactured in the company’s 12-inch wafer fabrication facility in Taichung, Taiwan.
The first product in the family, the W25Q80NE at 8Mb density at 1.2V is available today in samples and will be available in production in the beginning of 2018. The rest of the family of products ranging from 1Mb through 128Mb density at 1.2V, and wide range from 1.5V to 1.2V will follow. For specific details and for pricing on these products, please contact Winbond at SalesSupport@winbond.com.
About Winbond
Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions, headquartered in Taichung, Taiwan. Winbond’s major products include Specialty DRAM, Mobile DRAM, and Code Storage Flash Memory with Winbond’s memory business revenues in 2016 at US$1.08 billion. Winbond has approximately 2,500 employees worldwide, with offices in Taiwan, Hong Kong, China, Japan, Israel, and the USA. For more information, please visit: www.winbond.com.
SpiFlash is a registered trademark of Winbond Electronics Corporation. All other product names that appear in this material are for identification purposes only and are acknowledged trademarks or registered trademarks of their respective companies.
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