AnaGlobe's new unified chip-package layout solution is based on upgrades to the proven THUNDER platform. Traditionally the chip layout and package layout were designed and verified in separate environments. With the emerging demands of the wafer-level chip-scale packaging technologies, the collaborations among the engineers from packaging providers, foundries and IC design houses are getting more critical. But the complexity of the separate environments is often inefficient and ineffective, as data and information may be misinterpreted or lost during the conversion between different formats/environments.
AnaGlobe's new approach to solve the problem is based on upgrades to existing IC layout tools, which now support the functionality required by advanced packaging technologies: RDL routing, layout verification, layout editing, and customized tools for different packaging technologies.
For RDL routing, we support packaging technologies such as 2.5D with Silicon Interposer and TSVs, Integrated Fan-Out Wafer-Level Chip-Scale Package and Package-on-Package. Verification includes DRC, LVS, Connectivity Checking and Signal Path Tracing. Advanced Editing capabilities include: Netlist and Rule-Driven Editing, Bump Cell Automated Generation and Wire Width Adjustment. Customized Tools are available for Power/Ground Mesh Generation, Degassing Holes Generation and Dummy Insertion.
Thunder™ is a unique tape-out level layout editor with built-in XOR, density and Boolean engine. It handles layout data in excess of 500+GB in formats including GDS, OASIS, LEF/DEF, and OpenAccess, and performs complex geometrical operations accurately, fast and robust.
GOLF is an OpenAccess-based layout platform adopted by layout, packaging, and fabless design houses, design services, foundries and flat panel display manufacturers. GOLF features powerful layout editing functions, intuitive GUI and customization. The differentiation is in its customization for applications such as custom layout, analog layout automation, test structure layout automation, flat panel display layout automation, and wafer-level chip-scale packaging layout automation.
AnaGlobe Technology, Inc. is a leader in layout integration solutions, which have been adopted by world-wide technology leading companies including fabless, packaging, design service, foundries, panel, IP, etc. www.anaglobe.com
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SOURCE AnaGlobe
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