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Media Alert: Rambus to Demonstrate Its High-Speed Memory and SerDes IP Cores at GLOBALFOUNDRIES Technology Conference

(BUSINESS WIRE) — September 20, 2017 — At the 2017 GLOBALFOUNDRIES Technical Conference, Rambus will be showcasing its high-performance memory and SerDes PHYs developed for GLOBALFOUNDRIES high-performance ASIC Platform.

Additional Details:

HBM2

28G SerDes

Visit Rambus at Table #6 to learn more about its IP offerings and its partnership with GLOBALFOUNDRIES.

Follow Rambus:

Company website:  rambus.com

Rambus blog:  rambus.com/blog

Twitter:  @rambusinc

LinkedIn:  www.linkedin.com/company/rambus

Facebook:  www.facebook.com/RambusInc

About Rambus Memory and Interface Division

The Rambus Memory and Interface Division develops products and services that solve the power, performance, and capacity challenges of the communications and data center computing markets. Rambus enhanced standards-compatible and custom memory and serial link solutions include chips, architectures, memory and SerDes interfaces, IP validation tools, and system and IC design services. Developed through our system-aware design methodology, Rambus products deliver improved time-to-market and first-time-right quality.

About Rambus Inc.

Rambus creates innovative hardware and software technologies, driving advancements from the data center to the mobile edge. Our chips, customizable IP cores, architecture licenses, tools, software, services, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile payments, and smart ticketing. At Rambus, we are makers of better. For more information, visit  rambus.com.



Contact:

SHIFT Communications
Leslie Clavin, 415-591-8440
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