Winbond Introduces TrustME Secure Flash Memory Aligned with Platform Security Architecture from Arm

To meet the growing demand for high-volume embedded solutions, Winbond TrustME memories are manufactured in Winbond’s wholly owned and secured 12-inch wafer fabrication facility in Taichung, Taiwan.

The first product in the family, the W75F32 at 32Mb density is in production and available for samples.

Winbond has displays of TrustME W75F Secure Flash and will be conducting demonstrations at Arm TechCon, Oct 24-26 2017 at the Santa Clara Convention Center, Santa Clara, Calif., US.

For specific details and for pricing on these products, please contact Winbond at TrustME@winbond.com.

About Winbond

Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions, headquartered in Taichung, Taiwan. Winbond’s major products include Specialty DRAM, Mobile DRAM, and Code Storage Flash Memory with Winbond’s memory business revenues in 2016 over US$1 billion. Winbond has approximately 2,500 employees worldwide, with offices in Taiwan, Hong Kong, China, Japan, Israel, and the USA. For more information, please visit: www.winbond.com.

TrustME is a registered trademark of Winbond Electronics Corporation. All other product names that appear in this material are for identification purposes only and are acknowledged trademarks or registered trademarks of their respective companies.



Contact:

Product Contact
Winbond Electronics Corporation
Hung-Wei Chen
Secure Memory Product & Test Engineering Division Marketing Director
TEL: 886-3-567-8168 #71469
Email: Email Contact
or
News Contact
Jenny Chen
Sales Promotion Department
TEL: 886-3-5678168 #76333
E-mail:  Email Contact
or
Spokesperson
Jessica Chiou-Jii Huang
Vice President & Chief Financial Officer
TEL: 886-3-5678168/886-987-365682



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