SUNNYVALE, Calif. — (BUSINESS WIRE) — December 10, 2017 — Rambus Inc. (Nasdaq: RMBS):
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Who: |
Rambus Inc. (Nasdaq: RMBS) |
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What: |
Rambus to Present at the eSilicon Live Seminars, “ A Complete 14nm 2.4D, HBM2, SerDes ASIC Solution” |
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When and Where: |
December 11, 2017 | |
| Tokyo Conference Center Shinagawa | ||
| Area Shinagawa 3rd, 4th and 5th Floor | ||
| 1-9-36 Konan, Minato-ku, Tokyo, 108-0075 | ||
| Japan | ||
| December 14, 2017 | ||
| Kerry Hotel Pudong | ||
| Shanghai, No.1388 Hua Mu Road | ||
| Pudong, Shanghai, 201204 | ||
| China | ||
Join Rambus at the live seminars titled, “ A Complete 14nm 2.4D, HBM2, SerDes ASIC Solution” that discusses solutions for delivering 2.5D systems to support the development of applications in the high-performance computing, networking, deep learning and 5G markets. The live seminars will be held in both Tokyo and Shanghai.
Speaker Details
- Hear Chikara Hoshino, Senior Manager of Technical Marketing of Rambus Memory and Interfaces Division, discuss, “High-performance SerDes,” on Monday, December 11, 2017 at the Tokyo Conference Center Shinagawa from 10:30-15:30 local time.
- Listen to Mohit Gupta, Senior Product Marketing Manager of Rambus Memory and Interfaces Division, discuss, “High-performance SerDes,” on Thursday, December 14, 2017 at the Kerry Hotel Pudong in Shanghai from 10:30-15:30 local time.
For more information, visit https://www.rambus.com/events.
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About Rambus Memory and Interfaces Division
The Rambus Memory and Interfaces Division develops products and services that solve the power, performance, and capacity challenges of the communications and data center computing markets. Rambus enhanced standards-compatible and custom memory and serial link solutions include chips, architectures, memory and SerDes interfaces, IP validation tools, and system and IC design services. Developed through our system-aware design methodology, Rambus products deliver improved time-to-market and first-time-right quality.
About Rambus Inc.
Dedicated to making data faster and safer, Rambus creates innovative hardware, software and services that drive technology advancements from the data center to the mobile edge. Our architecture licenses, IP cores, chips, software, and services span memory and interfaces, security, and emerging technologies to positively impact the modern world. We collaborate with the industry, partnering with leading chip and system designers, foundries, and service providers. Integrated into tens of billions of devices and systems, our products power and secure diverse applications, including Big Data, Internet of Things (IoT) security, mobile payments, and smart ticketing. For more information, visit rambus.com.
Source: Rambus Inc.
View source version on businesswire.com: http://www.businesswire.com/news/home/20171210005075/en/
Contact:
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Leslie Clavin, 415-591-8440
Email Contact
or
Rambus
Corporate Communications
Cori Pasinetti, 408-462-8306
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