HOT CHIPS 30 - 2018
CALL FOR PRESENTATIONS
A Symposium on High-Performance Chips
Hot Chips30 2018:
Location TBD: Silicon Valley
Date TBD: August 2018
Hot Chips29 2017 In the News
- A Rare Peek Inside A 400G Cisco Network Chip
- Microsoft Leverages FPGAs for Real-Time AI
- Hot Chips 2017: Intel Deep Dives Into EMIB
- Hot Chips 2017: AMD Outlines Threadripper And EPYC’s MCM Advantage, Claims 41% Cost Reduction
- Microsoft Unveils Real-Time AI for Azure
- Hot Chips Spotlights Chip Stacks: Chiplets seen as the future of IP blocks
- Google Fellow: Neural Nets Need Optimized Hardware
- An Early Look at Baidu’s Custom AI and Analytics Processor
- Microsoft Details Xbox One X Scorpio Engine SoC
- Microsoft Announces Project Brainwave To Take On Google’s AI Hardware Lead
- Startup Unveils Graph Processor at Hot Chips
- Qualcomm moved its Snapdragon designers to its ARM server chip. We peek at the results
- Startup Runs MCU on 5 MicroW. Hot Chips to see demo of 0.25V IoT SoC
- Hot Chips Gets More Diverse
AUTHORS' SCHEDULE for submissions to Hot Chips 30
AREAS OF INTEREST:
| * General Purpose Processor Chips
- High-Performance and Low-Power - Multi-Core and Highly-Reliable Systems * Mobile and Embedded Devices - Graphics/Multimedia/Game - SoC, Security, and DSP Chips * Communications and Networking - Wireless LAN/WAN/PAN - Network and IO Processors * Emerging Computation Architectures - Machine Learning, Vision and Graphics/Compute Engines - Data Analytics and Big Data processing - IoT and Always-On Functions - Neuromorphic and Quantum Computing |
* Other Chips
- FPGAs and FPGA-Based Systems - Custom Chips for Emerging Applications - Open -Source Chips * Other Technologies - Power and Thermal Management - Packaging and TEsting - Display Technologies - On -Chip Optics & Sensors - Novel Computing Technologies * Memory Technologies - Persistent Memory, Phase Change - Packaging, 3D, Stacked * Software for Multi -Core, Heterogeneous Systems - Programming models, Runtime Systems - Performance, Power, Debug and Evaluation |
AUTHOR INFORMATION AND FORMAT
Presentations at HOT CHIPS are in the form of 30-minute talks in PowerPoint or .PDF. Presentation slides will be published in the HOT CHIPS Proceedings.
Participants are not required to submit written papers, but a select group will be invited to submit a paper for inclusion in a special issue of IEEE Micro. Poster submissions are also accepted from both industry and academia, and consist of 4 slides with a one-page summary. In particular, student posters describing applied research performed at a university are encouraged. The most outstanding student poster will receive a Best Student Poster Award.
Submissions must specify "Presentation", "Poster" or "Student Poster". Regular Presentations consist of a title, extended abstract (two pages maximum) and the presenter's contact information (name, affiliation, job title, address, phone(s), fax, and email). Please indicate whether you have submitted, intend to submit, or have already presented or published a similar or overlapping
submission to another conference or journal. Also indicate if you would like the submission to be held confidential. If so indicated, these submissions remain confidential until the first day of the conference. Submissions are evaluated by the Program Committee on the basis of performance of the device(s), degree of innovation, use of advanced technology, potential market significance, and anticipated interest to the audience. Research and software contributions will be evaluated with similar criteria. To the extent that you are describing a product, indicate its status - design, development, tape out, silicon, shipping, etc.
Send questions relating to the program to the program chairs Stefan Rusu and John Kobiatowicz at: program@hotchips.org
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