ZEISS Launches New High-resolution 3D X-ray Imaging Solutions for Advanced Semiconductor Packaging Failure Analysis

Xradia 800 Ultra 3D X-ray Microscope

Xradia Context 3D X-ray microCT System

ZEISS Logo

Cision View original content to download multimedia: http://www.prnewswire.com/news-releases/zeiss-launches-new-high-resolution-3d-x-ray-imaging-solutions-for-advanced-semiconductor-packaging-failure-analysis-300782593.html

SOURCE ZEISS

Contact:
Company Name: ZEISS
Semiconductor Manufacturing Technology, Ilka Hauswald
Phone: +49 7364 20-9231, Email Contact www.zeiss.com/newsroom
Web: http://www.zeiss.com



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