SAN JOSE, Calif. — (BUSINESS WIRE) — February 26, 2019 — Toshiba Memory America, Inc. (TMA), the U.S.-based subsidiary of Toshiba Memory Corporation, today announced that it will begin sampling new JEDEC e-MMC[1] Ver. 5.1[2] compliant embedded flash memory products for consumer applications next month. The new products integrate the company’s BiCS FLASH™ 3D flash memory and a controller in a single package.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20190226005459/en/
New e-MMC products from Toshiba Memory America integrate the company's BiCS FLASH 3D flash memory and a controller in a single package. (Photo: Business Wire)
The company will continue to reinforce its market-leading position by delivering a broad, high-performance product lineup, including for applications that continue to need e-MMC as an embedded memory solution.
“e-MMC remains an important solution for many applications,” noted Scott Beekman, director of managed flash memory products for Toshiba Memory America, Inc. “Our e-MMC products with BiCS FLASH 3D flash memory will enable these applications to continue to have access to the latest flash technology.”
Key Specifications
| Interface |
JEDEC e-MMC V5.1 standard
|
||
| Density[3] | 16GB, 32GB, 64GB, 128GB | ||
| Power Supply Voltage |
2.7V to 3.6V (Memory core)
1.7V to 1.95V (Interface) |
||
| Bus Width | ×1 / ×4 / ×8 | ||
| Temperature Range | -25℃ to +85℃ | ||
| Package |
153Ball FBGA
11.5mm × 13.0mm |
||
New Product Lineup
|
Product Name |
Capacity[3] | Package | Mass Production | ||||||
| THGAMRG7T13BAIL | 16GB | 11.5×13.0×0.8mm | 3Q, 2019 (Jul.-Sep.) | ||||||
| THGAMRG8T13BAIL | 32GB | 11.5×13.0×0.8mm | 3Q, 2019 (Jul.-Sep.) | ||||||
| THGAMRG9T23BAIL | 64GB | 11.5×13.0×0.8mm | 3Q, 2019 (Jul.-Sep.) | ||||||
| THGAMRT0T43BAIR | 128GB | 11.5×13.0×1.0mm | 3Q, 2019 (Jul.-Sep.) | ||||||
For more information, please visit business.toshiba-memory.com.
Notes:
| [1] | Embedded MultiMediaCard. e-MMC is a product category for a class of embedded memory products built to the JEDEC e-MMC Standard specification and is a trademark of the JEDEC Solid State Technology Association. The new product supports the command queuing and secure write protection functions which is specified as an option in JEDEC Ver. 5.1 | |
| [2] | One of standard specifications of embedded flash memory defined by JEDEC. | |
| [3] | Toshiba Memory Corporation defines a gigabyte (GB) as 1,000,000,000 bytes. Product density is identified based on the density of memory chip(s) within the Product, not the amount of memory capacity available for data storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application. For details, please refer to applicable product specifications. | |
About Toshiba Memory America, Inc.
Toshiba Memory America, Inc. is the U.S.-based subsidiary of Toshiba Memory Corporation, a leading worldwide supplier of flash memory and solid state drives (SSDs). From the invention of flash memory to today’s breakthrough 96-layer BiCS FLASH™ 3D technology, Toshiba continues to lead innovation and move the industry forward. For more information on Toshiba Memory, please visit business.toshiba-memory.com.
© 2019 Toshiba Memory America, Inc. All rights reserved. Information in this press release, including product pricing and specifications, content of services, and contact information is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.
View source version on businesswire.com: https://www.businesswire.com/news/home/20190226005459/en/
Contact:
MEDIA CONTACT:
Justine Houston-Brown
Lages & Associates
Tel.:
(949) 453-8080
Email Contact
COMPANY CONTACT:
Rebecca Bueno
Toshiba Memory America,
Inc.
Tel.: (949) 737-7321
Email Contact