TOKYO — (BUSINESS WIRE) — February 26, 2019 — Toshiba Memory Corporation, the world leader in memory solutions, today announced that it would begin sampling new JEDEC e-MMC Ver. 5.1[1] compliant embedded flash memory products utilizing BiCS FLASH™ 3D flash memory for consumer applications in the end of March.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20190226006346/en/
Toshiba Memory Corporation: e-MMC Ver. 5.1 Compliant Embedded Flash Memory Products Utilizing BiCS FLASH(TM) 3D Flash Memory (Photo: Business Wire)
e-MMC products are embedded flash memory products integrating flash memory chips and a controller in a single package.
The company will continue to reinforce its market-leading position by adding BiCS FLASH™ 3D memory embedded products to its lineup of flash memory products.
|
Key Specifications |
||
| Interface |
JEDEC e-MMC Ver. 5.1 standard
HS-MMC interface |
|
| Density | 16GB, 32GB, 64GB, 128GB[2] | |
| Power Supply Voltage |
2.7 to 3.6V (Memory core)
|
|
| Bus Width | ×1 / ×4 / ×8 | |
| Temperature Range | -25℃ to +85℃ | |
| Package |
153Ball FBGA
11.5mm × 13.0mm |
|
|
Line-up of the New Products |
||||||
| Product Name | Capacity | Package | Mass Production | |||
| THGAMRG7T13BAIL | 16GB | 11.5×13.0×0.8mm | 3Q, 2019 (Jul.-Sep.) | |||
| THGAMRG8T13BAIL | 32GB | 11.5×13.0×0.8mm | ||||
| THGAMRG9T23BAIL | 64GB | 11.5×13.0×0.8mm | ||||
| THGAMRT0T43BAIR | 128GB | 11.5×13.0×1.0mm | ||||
