Samsung Electronics’ Leadership in Advanced Foundry Technology Showcased with Latest Silicon Innovations and Ecosystem Platform

TM-Cloud offers us a very flexible design environment without requiring investment in additional infrastructure, as well as reduced design TAT. I expect this program to provide more tangible business and technical benefits to us and the entire fabless industry.”

Process technology roadmap and advanced packaging updates

Samsung’s roadmap includes four FinFET-based processes from 7nm down to 4nm that leverage extreme ultraviolet (EUV) technology as well as 3nm GAA, or MBCFET™.

In the second half of this year, Samsung is scheduled to start the mass production of 6nm process devices and complete the development of 4nm process.

The product design of Samsung’s 5nm FinFET process, which was developed in April, is expected to be completed in the second half of this year and go under mass production in the first half of 2020.

Extensions of the company’s FD-SOI (FDS) process and eMRAM together with an expanded set of state-of-the-art package solutions were also unveiled at this year’s Foundry Forum. Development of the successor to the 28FDS process, 18FDS, and eMRAM with 1Gb capacity will be finished this year.

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About Samsung Electronics Co., Ltd.

Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at http://news.samsung.com.



Contact:

Ujeong Jahnke
Samsung Semiconductor Europe GmbH
Tel. +49(0)6196-66-3300
Email: Email Contact



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