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SEMICON Japan 2022 to Spotlight Innovations Driving Semiconductor Industry Growth

TOKYO – October 11, 2022 – With Japan accounting for more than 30% of semiconductor manufacturing equipment and materials sales worldwide, the stage is set for SEMICON Japan 2022 as Japanese and international companies from across the microelectronics manufacturing supply chain gather December 14-16 at Tokyo Big Sight for insights into the latest technology innovations, developments and trends. Industry experts and visionaries will discuss pressing semiconductor industry topics including smart sensing, mobility, flexible hybrid electronics, advanced packaging and materials, and quantum computing. Registration is open.

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The new Advanced Packaging and Chiplet Summit (APCS) at SEMICON Japan will bring together industry leaders including AMD, ASE Group, Intel and NTT to discuss packaging innovations that are enabling more compact devices with lower power requirements, higher speeds and greater reliability – key in segments such as artificial intelligence (AI), 5G, and automotive. The Summit will also feature an exhibition and networking event. 

Industry Visionaries Presenting at SEMICON Japan 2022

SEMICON Japan 2022 to Spotlight Innovations Driving Semiconductor Industry Growth

 

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Dario Gil, Senior Vice President and Director,
IBM Research 

Opening Keynote Panel

IBM100 - International Business
                                    Machinesの誕生
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Tetsuro Higashi, Chairperson of the Executive Board, TIA; Chairman, Councils and Study Groups for
Semiconductor and Device Industry Strategy 

Opening Keynote Panel

TIA推�センター
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Ravi Mahajan, Fellow,
Intel

Advanced Packaging and Chiplet Summit

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Jun Sawada, Chairman, Representative Member of the Board, NTT

Keynote

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Chidi Chidambaram, Vice President of Engineering, Qualcomm 

Keynote

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Terushi Shimizu, Senior Executive Vice President,
Sony Group Corporation; Representative Director,
President and CEO,  Sony Semiconductor Solutions 

Grand Finale Panel

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SEMICON Japan 2022 Program Highlights

 

SEMICON Japan 2022 Sponsors

Learn more at SEMICON Japan 2022.
 

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit 
www.semi.org, contact one of our worldwide offices, and connect with SEMI on  LinkedIn and  Twitter to learn more.

Association Contacts

Hiroki Yomogita/SEMI Japan
Phone: 81.3.3222.5854
Email: jmarketing@semi.org

Michael Hall/SEMI
Phone: 1.408.943.7988
Email:  mhall@semi.org