Booth 2010
Solderstar, technology leaders in the design and development of temperature profiling equipment for the electronics industry, will present their expanded range of products at IPC APEX Expo 2023, San Diego, California, from January 24–26, 2023. Central to their booth will be the zero set-up SLX thermal datalogger which has recently been updated with a new extension to measure vacuum level in a reflow oven.
As electronic products continue to become smaller and more complex in construction, it is crucial to have soldering processes that can be adapted to achieve solder joints with fewer voids to increase reliability and improve product performance. A method gaining traction in the challenge to reduce voiding is vacuum reflow. To ensure the new SLX could enhance profile information at all stages of the soldering process, Solderstar has added an interface with advanced measurement adapters to verify parameters within the vacuum stage.
Mark Stansfield, CEO at Solderstar said: “Since launching the SLX thermal profiler, we have seen significant interest from companies looking for reliable temperature data capture to achieve solder joints with fewer voids. What differentiates SLX from other dataloggers is its zero set-up feature. As a result, it can be used quickly and easily to measure and record process parameters from any soldering process.
“Reflow oven manufacturers are starting to include a vacuum chamber stage in the oven to help to reduce voids. To ensure SLX is a long-term investment and effectively captures all parameters, we recently enhanced the system with additional sensors. These measure the temperature profile in the reflow oven, and the pressure level when the SLX passes through the vacuum chamber stage.
“There is a fundamental reason why we updated the SLX with additional sensors. Vacuum reflow has proven to reduce void levels and improve long-term stability and reliability of the solder joint. However, the vacuum level and rate at which the vacuum is applied are critical parameters that could not be measured independently to the temperature profile. The added feature allows the temperature profile in the reflow oven and the pressure level in the vacuum chamber stage to be captured simultaneously.
“This is particularly important when manufacturing high-reliability electronics. For example, if vacuum levels are not measured carefully it can result in insufficient void removals, or unnecessarily extended hold times in the vacuum. This means throughput is negatively affected with increased cycle times, and in-the -field reliability problems increase leading to rework or component failure.
“IPC Apex brings together industry professionals looking for solutions to manufacture quality electronics. Therefore, it is an ideal platform to introduce visitors to the Solderstar SLX with its advanced smart adapters to allow profiling of soldering machines with zero setup and configuration and independent vacuum level measurement.”
The zero user setup SLX allows faster and more accurate noise-free measurements from up to 12 temperature channels while simultaneously measuring from other secondary process parameter sensors. Furthermore, it works seamlessly with the latest version of the Solderstar profile analysis software, which is available for all the SLX units.
To view the advanced SLX system with its zero setup functionality, powerful multi-memory features, and the new vacuum level measurement integration, visit the Solderstar experts on booth 2010 at IPC APEX Expo 2023, San Diego, California, from January 24–26, 2023.
ENDS
Editor’s Notes:
Solderstar is a recognised technology leader in the design and manufacture of thermal profiling systems for electronic soldering processes.
With offices in UK, USA and a technical centre in Germany the company offers the most comprehensive range of process control support and solutions for electronic manufacturers.
Solderstar personnel have over 30 years of temperature profiling design experience, combined with in-depth industry and process knowledge, and a ‘can do’ attitude to product and process improvement.
When Solderstar launched its first product offerings, lead-free manufacturing was, for most in the industry, a dot on the horizon. For Solderstar, lead-free soldering was already upon us. It was recognised early-on that soldering within electronic assemblies was set to go through something of a revolution, with new thermal processes needing to be established and controlled like never before. It was seen that electronics manufacturers all over the world would need improved thermal profiling solutions capable of meeting the demands of the newly emerging thermal processes and advancement in soldering machines and ovens.
To respond to this, Solderstar developed class leading instrumentation and software that streamline the whole profiling process across reflow, wave, selective and vapour phase soldering processes. Solderstar has grown from strength to strength, completely dedicated from the outset to the needs of the electronic manufacturer. Solderstar is committed to excellence in design, customer support and product innovation.
Today, Solderstar products undoubtedly have ‘raised the bar’ and will continue to set the standard through our commitment to continual improvement of our products, and our ability to combine powerful functionality with robustness, accuracy, and simplicity.
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