A key feature of the Advanced Packaging Summit, after each session one hour will be dedicated to in-depth discussions between speakers and conference attendees about technology, market and business trends and issues.
Advanced Packaging Summit Sponsors
About SEMI
SEMI® connects 3,000 member companies and 1.3 million professionals worldwide to advance electronics design and manufacturing technology and business. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable more innovative, faster, powerful, and affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), and SOI Consortium are SEMI Strategic Technology Communities. Visit
www.semi.org, contact one of our worldwide offices and connect with SEMI on
LinkedIn and
Twitter to learn more.
Association Contacts
Jaegwan Shim/SEMI Korea
Phone: 82+2.531.7804
Email:
jshim@semi.org
Michael Hall/SEMI
Phone: 1.408.943.7988
Email:
mhall@semi.org
