SEOUL, Korea — August 29, 2023 — With advanced packaging a key enabler of semiconductor innovation, the stage is set for the Advanced Packaging Summit as industry leaders and visionaries gather September 5 at the Suwon Convention Center for insights into critical themes including advances in high-performance computing (HPC). Registration is open.

Representatives from chip manufacturing powerhouses such as AMD, Samsung Electronics and SK hynix will join leading packaging providers and research institutions to present on topics including HPC interconnection technologies, 3D packaging, chiplets, HIR (Heterogeneous Integration Roadmap), Hybrid Bonding, LAB (Laser Assisted Bonding), and supply chain management during two sessions.

Session 1: High-Performance Computing

	Wu Xin, Corporate Vice President, Silicon Technology AMD
	Ki Ill Moon, Vice President, Head of Packaging Technology Development SK hynix
	Donghan Kim, Sr. Staff and Head of Strategy Collaboration Solution Development Synopsys
	Stefan Chitoraga, Technology and Market Analyst, Packaging and Assembly Yole Group

Session 2: Interconnection Technology for High-Performance Computing

	Jongsoo Choi, Principal Professional Samsung Electronics
	Vikas Dubey, Senior Scientist Systems Packaging Fraunhofer ENAS
	Dongshun Bai, Senior Technologist and Business Development Director Brewer Science
	SeokHo Na, Master, Sr. Director of R&D Amkor Technology Korea

A key feature of the Advanced Packaging Summit, after each session one hour will be dedicated to in-depth discussions between speakers and conference attendees about technology, market and business trends and issues.

Advanced Packaging Summit Sponsors

About SEMI
SEMI^® connects 3,000 member companies and 1.3 million professionals worldwide to advance electronics design and manufacturing technology and business. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable more innovative, faster, powerful, and affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), and SOI Consortium are SEMI Strategic Technology Communities. Visit  www.semi.org, contact one of our worldwide offices and connect with SEMI on  LinkedIn and  Twitter to learn more.

Association Contacts

Jaegwan Shim/SEMI Korea
Phone: 82+2.531.7804
Email:  jshim@semi.org

Michael Hall/SEMI
Phone: 1.408.943.7988
Email:  mhall@semi.org