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About AMD
For more than 50 years AMD has driven innovation in high-performance computing, graphics and visualization technologies. Billions of people, leading Fortune 500 businesses and cutting-edge scientific research institutions around the world rely on AMD technology daily to improve how they live, work and play. AMD employees are focused on building leadership high-performance and adaptive products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD (NASDAQ: AMD)  website,  blog,  LinkedIn and  X pages.

AMD, the AMD Arrow logo, AMD Instinct, ROCm, EPYC and combinations thereof are trademarks of Advanced Micro Devices, Inc. Other names are for informational purposes only and may be trademarks of their respective owners.

CAUTIONARY STATEMENT

This press release contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) such as the features, functionality, performance, availability, timing and expected benefits of AMD Instinct™ MI300X accelerators; AMD Instinct™ MI300A APUs; El Capitan, a super-computer powered by AMD Instinct™ MI300 accelerators; AMD’s 30x from 2020-2025 energy efficiency goal; AMD Instinct™ platform; AMD Instinct MI300X based-bare metal instances; ROCm™ open software platform, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this press release are based on current beliefs, assumptions and expectations, speak only as of the date of this press release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and generally beyond AMD's control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: Intel Corporation’s dominance of the microprocessor market and its aggressive business practices; economic uncertainty; cyclical nature of the semiconductor industry; market conditions of the industries in which AMD products are sold; loss of a significant customer; impact of the COVID-19 pandemic on AMD’s business, financial condition and results of operations; competitive markets in which AMD’s products are sold; quarterly and seasonal sales patterns; AMD's ability to adequately protect its technology or other intellectual property; unfavorable currency exchange rate fluctuations; ability of third party manufacturers to manufacture AMD's products on a timely basis in sufficient quantities and using competitive technologies; availability of essential equipment, materials, substrates or manufacturing processes; ability to achieve expected manufacturing yields for AMD’s products; AMD's ability to introduce products on a timely basis with expected features and performance levels; AMD's ability to generate revenue from its semi-custom SoC products; potential security vulnerabilities; potential security incidents including IT outages, data loss, data breaches and cyber-attacks; potential difficulties in operating AMD’s newly upgraded enterprise resource planning system; uncertainties involving the ordering and shipment of AMD’s products; AMD’s reliance on third-party intellectual property to design and introduce new products in a timely manner; AMD's reliance on third-party companies for design, manufacture and supply of motherboards, software, memory and other computer platform components; AMD's reliance on Microsoft and other software vendors' support to design and develop software to run on AMD’s products; AMD’s reliance on third-party distributors and add-in-board partners; impact of modification or interruption of AMD’s internal business processes and information systems; compatibility of AMD’s products with some or all industry-standard software and hardware; costs related to defective products; efficiency of AMD's supply chain; AMD's ability to rely on third party supply-chain logistics functions; AMD’s ability to effectively control sales of its products on the gray market; impact of government actions and regulations such as export regulations, tariffs and trade protection measures; AMD’s ability to realize its deferred tax assets; potential tax liabilities; current and future claims and litigation; impact of environmental laws, conflict minerals-related provisions and other laws or regulations; impact of acquisitions, joint ventures and/or investments on AMD’s business and AMD’s ability to integrate acquired businesses;  impact of any impairment of the combined company’s assets; restrictions imposed by agreements governing AMD’s notes, the guarantees of Xilinx’s notes and the revolving credit facility; AMD's indebtedness; AMD's ability to generate sufficient cash to meet its working capital requirements or generate sufficient revenue and operating cash flow to make all of its planned R&D or strategic investments; political, legal and economic risks and natural disasters; future impairments of technology license purchases; AMD’s ability to attract and retain qualified personnel; and AMD’s stock price volatility. Investors are urged to review in detail the risks and uncertainties in AMD’s Securities and Exchange Commission filings, including but not limited to AMD’s most recent reports on Forms 10-K and 10-Q.

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¹ MI300-05A: Calculations conducted by AMD Performance Labs as of November 17, 2023, for the AMD Instinct™ MI300X OAM accelerator 750W (192 GB HBM3) designed with AMD CDNA™ 3 5nm FinFet process technology resulted in 192 GB HBM3 memory capacity and 5.325 TFLOPS peak theoretical memory bandwidth performance. MI300X memory bus interface is 8,192 and memory data rate is 5.2 Gbps for total peak memory bandwidth of 5.325 TB/s (8,192 bits memory bus interface * 5.2 Gbps memory data rate/8).

The highest published results on the NVidia Hopper H200 (141GB) SXM GPU accelerator resulted in 141GB HBM3e memory capacity and 4.8 TB/s GPU memory bandwidth performance.
https://nvdam.widen.net/s/nb5zzzsjdf/hpc-datasheet-sc23-h200-datasheet-3002446

The highest published results on the NVidia Hopper H100 (80GB) SXM5 GPU accelerator resulted in 80GB HBM3 memory capacity and 3.35 TB/s GPU memory bandwidth performance.

https://resources.nvidia.com/en-us-tensor-core/nvidia-tensor-core-gpu-datasheet

² MI300-15: The AMD Instinct™ MI300X (750W) accelerator has 304 compute units (CUs), 19,456 stream cores, and 1,216 Matrix cores.
The AMD Instinct™ MI250 (560W) accelerators have 208 compute units (CUs), 13,312 stream cores, and 832 Matrix cores.
The AMD Instinct™ MI250X (500W/560W) accelerators have 220 compute units (CUs), 14,080 stream cores, and 880 Matrix cores.

³ MI300-13: Calculations conducted by AMD Performance Labs as of November 7, 2023, for the AMD Instinct™ MI300X OAM accelerator 750W (192 GB HBM3) designed with AMD CDNA™ 3 5nm FinFet process technology resulted in 192 GB HBM3 memory capacity and 5.325 TFLOPS peak theoretical memory bandwidth performance. MI300X memory bus interface is 8,192 (1024 bits x 8 die) and memory data rate is 5.2 Gbps for total peak memory bandwidth of 5.325 TB/s (8,192 bits memory bus interface * 5.2 Gbps memory data rate/8).

The AMD Instinct™ MI250 (500W) / MI250X (560W) OAM accelerators (128 GB HBM2e) designed with AMD CDNA™ 2 6nm FinFet process technology resulted in 128 GB HBM3 memory capacity and 3.277 TFLOPS peak theoretical memory bandwidth performance. MI250/MI250X memory bus interface is 8,192 (4,096 bits times 2 die) and memory data rate is 3.20 Gbps for total memory bandwidth of 3.277 TB/s ((3.20 Gbps*(4,096 bits*2))/8).

⁴ MI300-34: Token generation throughput using DeepSpeed Inference with the Bloom-176b model with an input sequence length of 1948 tokens, and output sequence length of 100 tokens, and a batch size tuned to yield the highest throughput on each system comparison based on AMD internal testing using custom docker container for each system as of 11/17/2023.
Configurations:
2P Intel Xeon Platinum 8480C CPU powered server with 8x AMD Instinct™ MI300X 192GB 750W GPUs, pre-release build of ROCm™ 6.0, Ubuntu 22.04.2.
Vs.
An Nvidia DGX H100 with 2x Intel Xeon Platinum 8480CL Processors, 8x Nvidia H100 80GB 700W GPUs, CUDA 12.0, Ubuntu 22.04.3.
8 GPUs on each system were used in this test.
Server manufacturers may vary configurations, yielding different results. Performance may vary based on use of latest drivers and optimizations.

⁵ MI300-23: Calculations conducted by AMD Performance Labs as of Nov 16, 2023, for the AMD Instinct™ MI300X (192GB HBM3 OAM Module) 750W accelerator designed with AMD CDNA™ 3 5nm | 6nm FinFET process technology at 2,100 MHz peak boost engine clock resulted in 163.43 TFLOPS peak theoretical single precision (FP32) floating-point performance.