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CEA-Leti’s Signature Annual Gathering Will Highlight Microelectronics Technology Opportunities and the Recent Surge in Global Investing

Institute’s Commitment to Collaboration Is ‘Helping Industry Leaders and Innovators Accelerate Lab to Fab’ Projects

GRENOBLE, France – June 3, 2024 – With the global semiconductor industry gearing up to meet the huge anticipated growth in demand for miniaturized, more resource-efficient electronics for multiple applications, CEA-Leti will present its most recent innovations and breakthroughs to help meet that demand at

Leti Innovation Days, June 25-27 in Grenoble.

Leti Innovation Days 2024 will offer more than 1,000 semiconductor industry professionals a close-up look at new microelectronic solutions that will help power, control and enable ultra-sophisticated devices and equipment across the industrial, medical, automotive and consumer markets.

“CEA-Leti is committed to getting new semiconductor technologies from lab to fab swiftly and efficiently,” said CEA-Leti CEO Sébastien Dauvé. “We invest extensively in our pilot lines each year and, as chip production ramps up around the globe, this year presents unprecedented opportunities for CEOs, research & development directors, engineers and visionaries to innovate and deliver.”

Presentations, workshops and discussions will cover many timely and critical topics for the industry, ranging from AI, edge computing, augmented reality and green technologies to health care, telecommunications and optics.

“As always at CEA-Leti, partnerships will be instrumental to helping industry leaders and innovators accelerate their progress from lab to fab with relevant, robust and reliable products for their key markets,” said Michael Tchagaspanian, CEA-Leti EVP strategic partnerships & event chairman.

Plenaries, Workshops, Startups

Keynote Speakers

Conferences

Partner's Corner

Speak with CEA-Leti's  partners from the entire semiconductor value chain:

Startups’ Corner

Business Meetings

With dozens of semiconductor companies from around the world represented, Leti Innovation Days is where CEOs and CTOs come to meet. Targeted business meetings are the ideal way to find your next technology partner or provider.

Sponsors

Soitec, Schneider Electric, Siemens, Equans, Le Groupe BBM, BM&A, KELTEN, Weebit Nano, Global Foundries, SCREEN, Intel Foundry, ASML, Synopsys, EBARA, TEL, PREVAIL, NY CREATES, STMicroelectronics, AIXTRON, Electronmec, EVG, LAM Research, Entegris, Pfeiffer Vacuum, Banque Populaire Auvergne Rhône Alpes, Technic, Veeco, Edwards, ASM, Applied Materials, Lynred, Thermo Fisher, and with support from Auvergne Rhône-Alps Region, Carnot Institutes network, Grenoble Alpes Métropole and SEMI.

Media Partners

EE Times Europe, EE News Europe, Microwave Journal, Silicon Semiconductor, Compound Semiconductor, Times Tech, SemiWiki, Pradeep’s Techpoints and Yole Group.

 

About CEA-Leti (France)

CEA-Leti, a technology research institute at CEA, is a global leader in miniaturization technologies enabling smart, energy-efficient and secure solutions for industry. Founded in 1967, CEA-Leti pioneers micro-& nanotechnologies, tailoring differentiating applicative solutions for global companies, SMEs and startups. CEA-Leti tackles critical challenges in healthcare, energy and digital migration. From sensors to data processing and computing solutions, CEA-Leti’s multidisciplinary teams deliver solid expertise, leveraging world-class pre-industrialization facilities. With a staff of more than 2,000 talents, a portfolio of 3,200 patents, 11,000 sq. meters of cleanroom space and a clear IP policy, the institute is based in Grenoble, France, and has offices in Silicon Valley, Brussels and Tokyo. CEA-Leti has launched 76 startups and is a member of the Carnot Institutes network. Follow us on www.leti-cea.com and @CEA_Leti.

Technological expertise

CEA has a key role in transferring scientific knowledge and innovation from research to industry. This high-level technological research is carried out in particular in electronic and integrated systems, from microscale to nanoscale. It has a wide range of industrial applications in the fields of transport, health, safety and telecommunications, contributing to the creation of high-quality and competitive products.

For more information: www.cea.fr/english 

Press Contact                                                                                

Agency

Sarah-Lyle Dampoux

Email Contact

+33 6 74 93 23 47

 



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