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Toshiba Announces Space-Saving Dual Channel IC-Couplers

Surface Mount Optocouplers in S08 Packages Reduce Board Area by 40 Percent Compared to Single-Channel Devices

IRVINE, Calif., April 8 /PRNewswire/ -- Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, has expanded its IC photocoupler lineup with three dual-channel, totem-pole output devices housed in low profile S08 packages. Each of these devices, developed by Toshiba Corp. (Toshiba), reduce board area by approximately 40 percent per channel compared to single-channel devices in MFSOP6 packages to help reduce size and cost of multi-channel applications.

Two 5Mbps devices include the TLP2105, with buffer logic output, and the TLP2108, with inverter logic output. Applications for these photocouplers include insulated bus drivers, high speed line receivers, and system interfaces for microprocessors.

The 15Mbps TLP2166A features inverter logic output and a supply voltage of 3.3V, making it suitable for high speed, low-voltage applications such as interfaces for digital measurement and control equipment, insulated PC boards and various communication protocols.

Technical Specifications TLP2105

    Specification           Symbol           TLP2105               TLP2108

    Package                                 S08 5.1mm x         S08 5.1mm x
                                             3.95mm x             3.95mm x
                                              2.5mm                2.5mm

    Output type                          General purpose,     General purpose,
                                          buffer logic        inverter logic
                                          (totem-pole)        (totem-pole)

    Power supply voltage      V(CC)        4.5 to 20V            4.5 to 20V

    Input current logic       I(F)           1.6mA                  1.6mA
     high output (max.)

    Logic low output          V(OL)           0.6V                   0.6V
     voltage (max.)

    Propagation delay time   t(pHL)          250ns                  250ns
     (max.) (H to L)

    Propagation delay time   t(pLH)          250ns                  250ns
     (max.) (L to H)

    Operating temperature    T(opr)   -40 degrees C to       -40 degrees C to
     range                              +100 degrees C         +100 degrees C

    Common-mode transient    CMR          +/-10kV/us             +/-10kV/us
     immunity (min.)

    Isolation voltage        BV(S)         2500Vrms               2500Vrms
     (min.)

Technical Specifications TLP2166A

    Specification                   Symbol

    Package                                      S08 5.1mm x 3.95mm x 2.5mm

    Output type                               General purpose, inverter logic
                                                        (totem pole)

    Power supply voltage          V(CC)                  3.0 to 3.6V

    Input current logic high      I(FHL)                    3mA
     output (max.)

    Propagation delay time
     (max.) (H to L)              t(pHL)                   75ns

    Propagation delay time        t(pLH)                   75ns
     (max.)  (L to H)

    Operating temperature         T(opr)              -40 degrees C to
     range                                             +100 degrees C

    Common-mode transient         CMR                  +/-15 kV/us
     immunity (min.)

    Isolation voltage (min.)      BV(S)                  2500Vrms

Pricing and Availability

Samples of the Toshiba dual-channel photocouplers are available now. Prices for the 5Mbps TLP2105 and TLP2108 are $1.72 in quantities of 100. The TLP2166A is priced at $2.00 each in quantities of 100.

Toshiba's Discrete Products

Since 1986, Toshiba Corp. has ranked as the top discrete supplier on a worldwide basis, based on annual revenue from international shipments of total discrete products. According to the most recent annual report from market research firm Gartner Dataquest (San Jose, CA), Toshiba remained the top discrete semiconductor supplier. (Source: "2007 Worldwide Semiconductor Market Share Report," Gartner, released April 2008). More specifically, Toshiba is a leading supplier in a number of discrete product categories, including power transistors, rectifiers and thyristors, LMOS logic, CMOS logic, photocouplers, Toslinks(TM), LEDs, small signal diodes and transistors. The company's discrete devices are designed to meet the growing demand for high-performance and lower voltages in today's wireless telecommunications and consumer electronics applications, while emphasizing its strength in the automotive and industrial markets.

*About TAEC and Toshiba Corp.

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, distributions and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, discrete devices, displays, advanced materials, medical tubes, custom SoCs/ASICs, digital multimedia and imaging products, microcontrollers and wireless components that make possible today's leading cell phones, MP3 players, cameras, medical devices, automotive electronics and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's third largest semiconductor manufacturer (Gartner, Preliminary 2008 WW Semiconductor Revenue Ranking, Dec. 2008). For additional company and product information, please visit http://www.toshiba.com/taec/.

Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at www.chips.toshiba.com, or from your TAEC representative.

Web site: http://www.toshiba.com/taec/