SEOUL, Korea — August 29, 2023 — With advanced packaging a key enabler of semiconductor innovation, the stage is set for the Advanced Packaging Summit as industry leaders and visionaries gather September 5 at the Suwon Convention Center for insights into critical themes including advances in high-performance computing (HPC). Registration is open.

Representatives from chip manufacturing powerhouses such as AMD, Samsung Electronics and SK hynix will join leading packaging providers and research institutions to present on topics including HPC interconnection technologies, 3D packaging, chiplets, HIR (Heterogeneous Integration Roadmap), Hybrid Bonding, LAB (Laser Assisted Bonding), and supply chain management during two sessions.

Session 1: High-Performance Computing

	Wu Xin, Corporate Vice President, Silicon Technology AMD
	Ki Ill Moon, Vice President, Head of Packaging Technology Development SK hynix
	Donghan Kim, Sr. Staff and Head of Strategy Collaboration Solution Development Synopsys
	Stefan Chitoraga, Technology and Market Analyst, Packaging and Assembly Yole Group

Session 2: Interconnection Technology for High-Performance Computing

	Jongsoo Choi, Principal Professional Samsung Electronics
	Vikas Dubey, Senior Scientist Systems Packaging Fraunhofer ENAS
	Dongshun Bai, Senior Technologist and Business Development Director Brewer Science
	SeokHo Na , Master, Sr. Director of R&D Amkor Technology Korea